⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL896793 | 1.00 | — | — | |
| SCHEMBL17180834 | 0.74 | CYP1A2 (0.33) | — | |
| SCHEMBL15392557 | 0.73 | — | — | |
| SCHEMBL20873733 | 0.70 | CD81 (0.31) | — | |
| SCHEMBL992475 | 0.70 | CD81 (0.31) | — | |
| Methacrylic Acid SCHEMBL28395192 | 0.68 | TSHR (0.31) | — | |
| SCHEMBL949524 | 0.67 | TSHR (0.40) | — | |
| SCHEMBL743445 | 0.67 | TSHR (0.40) | — | |
| SCHEMBL12503508 | 0.66 | TSHR (0.34) | — | |
| SCHEMBL1257392 | 0.65 | AKR1C3 (0.35) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12319849-B2 | Adhesive composition, room-temperature-curable adhesive, and cured object | KANEKA CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| US-20250046626-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | RESONAC CORPORATION (JP) | 2025-02-06 | — | — | US | disclosed |
| US-12165882-B2 | Semiconductor device manufacturing method | RESONAC CORPORATION (JP) | 2024-12-10 | — | — | US | disclosed |
| US-20240101878-A1 | ADHESIVE COMPOSITION, ROOM-TEMPERATURE-CURABLE ADHESIVE, AND CURED OBJECT | KANEKA CORPORATION (JP) | 2024-03-28 | — | — | US | disclosed |
| CN-115668446-A | Temporary fixing laminate film, method for producing same, temporary fixing laminate, and method for producing semiconductor device | 昭和电工材料株式会社 | 2023-01-31 | — | — | CN | disclosed |
| US-20220319872-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | RESONAC CORPORATION (JP) | 2022-10-06 | — | — | US | disclosed |
| WO-2022113161-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 昭和電工マテリアルズ株式会社 | 2022-06-02 | — | — | WO | disclosed |
| WO-2022113829-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD | 昭和電工マテリアルズ株式会社 | 2022-06-02 | — | — | WO | disclosed |
| WO-2022071150-A1 | FILM FOR TEMPORARY FIXATION, LAYERED PRODUCT FOR TEMPORARY FIXATION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-04-07 | — | — | WO | disclosed |
| WO-2022071431-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING FILM MATERIAL FOR TEMPORARY FIXING, AND FILM MATERIAL FOR TEMPORARY FIXING | 昭和電工マテリアルズ株式会社 | 2022-04-07 | — | — | WO | disclosed |
| CN-105385362-B | Adhesive composition and connection structure | 日立化成株式会社 | 2020-05-15 | — | — | CN | disclosed |
| US-10392522-B2 | Ultraviolet curable composition and recorded object | SEIKO EPSON CORPORATION (JP) | 2019-08-27 | — | — | US | disclosed |
| US-9873808-B2 | Ultraviolet-curable ink jet ink composition | SEIKO EPSON CORPORATION (JP) | 2018-01-23 | — | — | US | disclosed |
| EP-3067395-A1 | ULTRAVIOLET RADIATION-CURABLE COMPOSITION, AND RECORDED MATTER | Seiko Epson Corporation (JP) | 2016-09-14 | — | — | EP | disclosed |
| US-20160257827-A1 | ULTRAVIOLET CURABLE COMPOSITION AND RECORDED OBJECT | SEIKO EPSON CORPORATION (JP) | 2016-09-08 | — | — | US | disclosed |
| US-20150225581-A1 | ULTRAVIOLET-CURABLE INK JET INK COMPOSITION | SEIKO EPSON CORP (JP) | 2015-08-13 | — | — | US | disclosed |
| US-9034940-B2 | Ultraviolet-curable ink jet ink composition | SEIKO EPSON CORPORATION (JP) | 2015-05-19 | — | — | US | disclosed |
| US-20140128496-A1 | ULTRAVIOLET-CURABLE INK JET INK COMPOSITION | SEIKO EPSON CORPORATION (JP) | 2014-05-08 | — | — | US | disclosed |
| US-8664291-B2 | Ultraviolet-curable ink jet ink composition | SEIKO EPSON CORPORATION (JP) | 2014-03-04 | — | — | US | disclosed |
| US-20120083545-A1 | ULTRAVIOLET-CURABLE INK JET INK COMPOSITION | SEIKO EPSON CORPORATION | 2012-04-05 | — | — | US | disclosed |