Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CD81 | P60033 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20873733 | 1.00 | CD81 (0.31) | CD81 | |
| SCHEMBL17180832 | 0.75 | — | — | |
| SCHEMBL896796 | 0.70 | — | — | |
| SCHEMBL896793 | 0.70 | — | — | |
| SCHEMBL22462252 | 0.66 | CYP1A2 (0.30) | — | |
| SCHEMBL16516857 | 0.63 | ALDH1A1 (0.34) | — | |
| SCHEMBL5809733 | 0.62 | ALDH1A1 (0.31) | — | |
| SCHEMBL6561901 | 0.62 | — | — | |
| SCHEMBL844616 | 0.62 | — | — | |
| SCHEMBL534671 | 0.60 | ALDH1A1 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2399958-B1 | COMPOSITE CONDUCTIVE POLYMER COMPOSITION, METHOD FOR PRODUCING SAME, SOLUTION CONTAINING THE COMPOSITION, AND USE OF THE COMPOSITION | SOKEN KAGAKU KK (JP) | 2016-09-07 | — | — | EP | claimed |
| US-20110309308-A1 | COMPOSITE CONDUCTIVE POLYMER COMPOSITION, METHOD OF MANUFACTURING THE SAME, SOLUTION CONTAINING THE COMPOSITION, USE OF THE COMPOSITION | SOKEN CHEMICAL & ENGINEERING CO., LTD. (JP) | 2011-12-22 | — | — | US | claimed |
| US-20070184293-A1 | RESIN COMPOSITION FOR ORGANIC INSULATING LAYER, METHOD OF MANUFACTURING RESIN COMPOSITION, AND DISPLAY PANEL INCLUDING RESIN COMPOSITION | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-08-09 | — | — | US | claimed |
| US-12319849-B2 | Adhesive composition, room-temperature-curable adhesive, and cured object | KANEKA CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| EP-3882673-B1 | TRANSPARENT LAMINATE | DEXERIALS CORP (JP) | 2024-12-04 | — | — | EP | disclosed |
| US-20240101878-A1 | ADHESIVE COMPOSITION, ROOM-TEMPERATURE-CURABLE ADHESIVE, AND CURED OBJECT | KANEKA CORPORATION (JP) | 2024-03-28 | — | — | US | disclosed |
| US-20230321657-A1 | SPECIMEN ANALYSIS CARTRIDGE AND MANUFACTURING METHOD FOR THE SAME | SYSMEX CORPORATION (JP) | 2023-10-12 | — | — | US | disclosed |
| US-11441030-B2 | Resin composition and film formed from same | TEIJIN LIMITED (JP) | 2022-09-13 | — | — | US | disclosed |
| WO-2022080359-A1 | WAVELENGTH CONVERSION MEMBER MOLDING COMPOSITION, COLOR RESIST, COLOR FILTER, METHOD FOR MANUFACTURING COLOR RESIST, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE | パナソニックＩＰマネジメント株式会社 | 2022-04-21 | — | — | WO | disclosed |
| EP-3882673-A1 | TRANSPARENT LAMINATE | Dexerials Corporation (JP) | 2021-09-22 | — | — | EP | disclosed |
| US-11124657-B2 | Transparent laminate | DEXERIALS CORPORATION (JP) | 2021-09-21 | — | — | US | disclosed |
| US-20090244116-A1 | INKJET RECORDING METHOD AND INKJET RECORDING SYSTEM | FUJIFILM CORPORATION (JP) | 2009-10-01 | — | — | US | disclosed |
| US-7585813-B2 | Reversible thermosensitive recording medium, label and member, and image processing apparatus and method | RICOH COMPANY, LTD. (JP) | 2009-09-08 | — | — | US | disclosed |
| US-20090214797-A1 | INKJET INK COMPOSITION, AND INKJET RECORDING METHOD AND PRINTED MATERIAL EMPLOYING SAME | FUJIFILM CORPORATION (JP) | 2009-08-27 | — | — | US | disclosed |
| US-20090087626-A1 | INK COMPOSITION, INKJET RECORDING METHOD, PRINTED MATERIAL, AND PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL | FUJIFILM CORPORATION (JP) | 2009-04-02 | — | — | US | disclosed |
| EP-1491354-B1 | Reversible thermosensitive recording medium, label, and image recording method | RICOH KK (JP) | 2008-01-16 | — | — | EP | disclosed |
| US-20070225163-A1 | Reversible thermosensitive recording medium, label and member, and image processing apparatus and method | SHIMBO HITOSHI | 2007-09-27 | — | — | US | disclosed |
| US-20070184293-A1 | RESIN COMPOSITION FOR ORGANIC INSULATING LAYER, METHOD OF MANUFACTURING RESIN COMPOSITION, AND DISPLAY PANEL INCLUDING RESIN COMPOSITION | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-08-09 | — | — | US | disclosed |
| US-7238642-B2 | Reversible thermosensitive recording medium, label and member, and, image processing apparatus and method | RICOH COMPANY, LTD. (JP) | 2007-07-03 | — | — | US | disclosed |
| US-20050014645-A1 | Reversible thermosensitive recording medium, label and member, and, image processing apparatus and method | RICOH COMPANY, LTD. (JP) | 2005-01-20 | — | — | US | disclosed |