SCHEMBL8980249

SCHEMBL8980249

C=CC1C=CC=CN1CCCS(=O)(=O)O

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL27811237 0.98 APP (0.32) APP
SCHEMBL10430356 0.98 APP (0.32) APP
SCHEMBL28671152 0.95 APP (0.32) APP
Glycine SCHEMBL28849450 0.91 APP (0.33) APP
Glycinebetaine SCHEMBL9505082 0.86
SCHEMBL27544372 0.85
Ammonia Solution, Strong SCHEMBL27984685 0.84
SCHEMBL28667240 0.78 APP (0.30) APP
SCHEMBL8980213 0.78 APP (0.36) APP
SCHEMBL9682161 0.76 APP (0.39) APP

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115491664-A Ionic palladium activator for vertical copper deposition wire and preparation method thereof 广东利尔化学有限公司 2022-12-20 CN claimed
CN-1307209-C Poly (vinyl alcohol) -co-poly (vinylamine) polymers comprising functional moieties CIBA SC HOLDING AG (CH) 2007-03-28 CN claimed
CN-121863009-A Multifunctional battery diaphragm, preparation method thereof, electrochemical device and application 青岛赛锂达储能产业技术研究院有限公司 2026-04-14 CN disclosed
CN-119710842-A Palladium-nickel alloy electroplating solution 武汉天立表面技术有限公司 2025-03-28 CN disclosed
CN-117396754-A Separation of nucleic acid component compounds on zwitterionic stationary phases 沃特世科技公司 2024-01-12 CN disclosed
CN-113529479-B Method for improving bulk strength of paper by using diallylamine acrylamide copolymers in starch-containing size press formulations 艺康美国股份有限公司 2023-04-25 CN disclosed
CN-115491664-A Ionic palladium activator for vertical copper deposition wire and preparation method thereof 广东利尔化学有限公司 2022-12-20 CN disclosed
CN-109414655-A Coated porous polymer membranes 恩特格里斯公司 2019-03-01 CN disclosed
CN-107109796-A The method for improving paper intensity 艺康美国股份有限公司 2017-08-29 CN disclosed
CN-104053743-B Compositions and methods for producing hydrocarbon fluids from subterranean reservoirs 纳尔科公司 2017-08-08 CN disclosed
CN-106795695-A Method for increasing bulk strength of paper by using diallylamine acrylamide copolymers in size press formulations containing starch 艺康美国股份有限公司 2017-05-31 CN disclosed
CN-102471911-B Process for the electrolytic copper plating of zinc diecasting having a reduced tendency to blister formation UMICORE GALVANOTECHNIK GMBH (DE) 2014-10-15 CN disclosed
CN-102574960-A Water dispersible, cyclic-carbonate-functionalized vinyl copolymer system CONSTR RES & TECH GMBH 2012-07-11 CN disclosed
CN-102471911-A Method for electrolytic copper plating of zinc diecastings with reduced tendency to blister formation UMICORE GALVANOTECHNIK GMBH 2012-05-23 CN disclosed
CN-102016130-A Modified copper-tin electrolyte and method of depositing bronze layers UMICORE GALVANOTECHNIK GMBH 2011-04-13 CN disclosed
CN-102015850-A Modified halogenated polymer surfaces BASF SE 2011-04-13 CN disclosed
CN-1307209-C Poly (vinyl alcohol) -co-poly (vinylamine) polymers comprising functional moieties CIBA SC HOLDING AG (CH) 2007-03-28 CN disclosed
US-5503877-A ORGANONITROGEN, ORGANOMETALLIC POLYMERS OR OLIGOMERS;REDUCTION ATOTECH DEUTSCHALND GMBH (DE) 1996-04-02 US disclosed
US-5165971-A ACTIVATING COMPOSITION FOR PLATING OF ELECTRICALLY INSULATIVE SUBSTRATES AND METHOD FOR PLATING OF SUCH SUBSTRATES USING SAID COMPOSITION KEMIFAR S.P.A. (IT) 1992-11-24 US disclosed
EP-0381873-A2 Activating composition for plating of electrically insulative substrates and method for plating of such substrates using said composition KEMIFAR S.P.A. (IT) 1990-08-16 EP disclosed