Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APP | P05067 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | SLC6A6 | P31641 | 1/20 | 0.33 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.33 |
| ▸ | BLM | P54132 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10430394 | 0.98 | APP (0.38) | APPLMNASLC6A6CYP2C19BLM | |
| SCHEMBL8980213 | 0.81 | APP (0.36) | APPLMNASLC6A6CYP2C19BLM | |
| SCHEMBL10430358 | 0.80 | APP (0.35) | APP | |
| SCHEMBL8980249 | 0.76 | APP (0.32) | APP | |
| Water SCHEMBL27811237 | 0.75 | APP (0.32) | APP | |
| SCHEMBL10430356 | 0.75 | APP (0.32) | APP | |
| SCHEMBL27918945 | 0.73 | — | — | |
| Glycine SCHEMBL28849450 | 0.72 | APP (0.33) | APP | |
| SCHEMBL28671152 | 0.72 | APP (0.32) | APP | |
| SCHEMBL28852487 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115491664-A | Ionic palladium activator for vertical copper deposition wire and preparation method thereof | 广东利尔化学有限公司 | 2022-12-20 | — | — | CN | claimed |
| CN-115491664-A | Ionic palladium activator for vertical copper deposition wire and preparation method thereof | 广东利尔化学有限公司 | 2022-12-20 | — | — | CN | disclosed |
| US-5165971-A | ACTIVATING COMPOSITION FOR PLATING OF ELECTRICALLY INSULATIVE SUBSTRATES AND METHOD FOR PLATING OF SUCH SUBSTRATES USING SAID COMPOSITION | KEMIFAR S.P.A. (IT) | 1992-11-24 | — | — | US | disclosed |
| EP-0381873-A2 | Activating composition for plating of electrically insulative substrates and method for plating of such substrates using said composition | KEMIFAR S.P.A. (IT) | 1990-08-16 | — | — | EP | disclosed |