Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.41 |
| ▸ | AKR1C3 | P42330 | 1/20 | 0.41 |
| ▸ | AKR1C1 | Q04828 | 1/20 | 0.41 |
| ▸ | SLC6A2 | P23975 | 4/20 | 0.40 |
| ▸ | SLC6A4 | P31645 | 3/20 | 0.40 |
| ▸ | SLC6A3 | Q01959 | 3/20 | 0.40 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.40 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.40 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.40 |
| ▸ | TSHR | P16473 | 3/20 | 0.39 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.39 |
| ▸ | CYP19A1 | P11511 | 2/20 | 0.37 |
| ▸ | CFTR | P13569 | 1/20 | 0.36 |
| ▸ | GOPC | Q9HD26 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | HTR2A | P28223 | 1/20 | 0.32 |
| ▸ | HRH1 | P35367 | 1/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.32 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11505453 | 0.91 | CYP19A1 (0.36) | ALDH1A1AKR1C3AKR1C1CYP19A1GAA | |
| Water SCHEMBL11606806 | 0.79 | ALDH1A1 (0.45) | ALDH1A1SLC6A2TSHRMEN1KMT2A | |
| Water SCHEMBL11606809 | 0.79 | ALDH1A1 (0.45) | ALDH1A1SLC6A2TSHRMEN1KMT2A | |
| Benzene SCHEMBL28295973 | 0.79 | ALDH1A1 (0.45) | ALDH1A1SLC6A2TSHRMEN1KMT2A | |
| SCHEMBL1259441 | 0.79 | — | — | |
| SCHEMBL28530865 | 0.77 | ALDH1A1 (0.43) | ALDH1A1SLC6A2TSHRMEN1KMT2A | |
| Hydrogen Sulfide SCHEMBL28113733 | 0.77 | ALDH1A1 (0.43) | ALDH1A1SLC6A2TSHRMEN1KMT2A | |
| SCHEMBL228320 | 0.77 | ALDH1A1 (0.43) | ALDH1A1SLC6A2TSHRMEN1KMT2A | |
| Hydrochloric Acid SCHEMBL27825197 | 0.77 | ALDH1A1 (0.43) | ALDH1A1SLC6A2TSHRMEN1KMT2A | |
| SCHEMBL9853603 | 0.77 | ALDH1A1 (0.43) | ALDH1A1SLC6A2TSHRMEN1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | claimed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | claimed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | claimed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | claimed |
| US-4486583-A | MOLDING MATERIALS, COATINGS | HITACHI, LTD. (JP) | 1984-12-04 | — | — | US | claimed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | claimed |
| EP-0476589-B1 | Multi-layer wiring substrate and production thereof | HITACHI LTD (JP) | 1996-06-12 | — | — | EP | disclosed |
| EP-0476589-A2 | Multi-layer wiring substrate and production thereof | HITACHI, LTD. (JP) | 1992-03-25 | — | — | EP | disclosed |
| EP-0153603-B1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRODUCTION OF CURED PRODUCT | HITACHI, LTD. (JP) | 1992-01-02 | — | — | EP | disclosed |
| EP-0102052-B1 | HEAT-RESISTANT RESIN, THERMOSETTING COMPOSITION AFFORDING THE SAME AND PREPOLYMER THEREOF | HITACHI, LTD. (JP) | 1990-10-31 | — | — | EP | disclosed |
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | disclosed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | disclosed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | disclosed |
| EP-0078039-B1 | THERMOSETTING RESIN COMPOSITION, PREPOLYMER THEREOF AND CURED ARTICLE THEREOF | Hitachi, Ltd. (JP) | 1986-01-22 | — | — | EP | disclosed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | disclosed |
| EP-0153603-A2 | Thermosetting resin composition, cured product, and production of cured product | HITACHI, LTD. (JP) | 1985-09-04 | — | — | EP | disclosed |
| US-4486583-A | MOLDING MATERIALS, COATINGS | HITACHI, LTD. (JP) | 1984-12-04 | — | — | US | disclosed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | disclosed |
| EP-0102052-A2 | Heat-resistant resin, thermosetting composition affording the same and prepolymer thereof | HITACHI, LTD. (JP) | 1984-03-07 | — | — | EP | disclosed |
| EP-0078039-A1 | Thermosetting resin composition, prepolymer thereof and cured article thereof | Hitachi, Ltd. (JP) | 1983-05-04 | — | — | EP | disclosed |