⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29636264 | 1.00 | — | — | |
| SCHEMBL11540807 | 0.87 | — | — | |
| SCHEMBL29411168 | 0.87 | — | — | |
| SCHEMBL29581305 | 0.87 | — | — | |
| SCHEMBL29785074 | 0.87 | — | — | |
| SCHEMBL11521893 | 0.82 | — | — | |
| SCHEMBL19137409 | 0.82 | — | — | |
| SCHEMBL4359963 | 0.82 | — | — | |
| SCHEMBL5723927 | 0.82 | — | — | |
| SCHEMBL7626201 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119287211-A | Nickel-lead-copper alloy and preparation method thereof | 四川科派新材料有限公司 | 2025-01-10 | — | — | CN | claimed |
| CN-116656953-A | Method for extracting and recovering heavy metals | 新加坡国立大学 | 2023-08-29 | — | — | CN | claimed |
| CN-101348280-A | Method for preparing electronic grade non-selenium manganomanganic oxide from dialogite | HUNAN ORIENTAL MN INDUSTRY GRO (CN) | 2009-01-21 | — | — | CN | claimed |
| CN-120790698-A | Hot extrusion die for lead nickel copper alloy bar | 四川鑫超巍新材料科技有限公司 | 2025-10-17 | — | — | CN | disclosed |
| CN-120790698-A | Hot extrusion die for lead nickel copper alloy bar | 四川鑫超巍新材料科技有限公司 | 2025-10-17 | — | — | CN | disclosed |
| US-20250149456-A1 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2025-05-08 | — | — | US | disclosed |
| CN-119287211-A | Nickel-lead-copper alloy and preparation method thereof | 四川科派新材料有限公司 | 2025-01-10 | — | — | CN | disclosed |
| CN-119287211-A | Nickel-lead-copper alloy and preparation method thereof | 四川科派新材料有限公司 | 2025-01-10 | — | — | CN | disclosed |
| CN-119287211-A | Nickel-lead-copper alloy and preparation method thereof | 四川科派新材料有限公司 | 2025-01-10 | — | — | CN | disclosed |
| CN-222318248-U | Circuit board, temperature measuring equipment and vehicle | 广州小鹏汽车科技有限公司 | 2025-01-07 | — | — | CN | disclosed |
| CN-118461312-A | Preparation method of graphene/nickel composite fiber with high flexibility and high electromagnetic shielding performance | 西北工业大学 | 2024-08-09 | — | — | CN | disclosed |
| CN-110579286-A | Temperature measuring device of electric energy meter | 株式会社村田制作所 | 2019-12-17 | — | — | CN | disclosed |
| CN-103435219-A | Heavy metal wastewater treatment method | LIUZHOU BOZE SCIENCE & TECHNOLOGY CO LTD | 2013-12-11 | — | — | CN | disclosed |
| CN-202105466-U | Cooling unit assembled settling tank for flash furnace | JINLONG COPPER CO LTD | 2012-01-11 | — | — | CN | disclosed |
| CN-101348280-B | Method for preparing electronic grade non-selenium manganomanganic oxide from dialogite | HUNAN ORIENTAL MN INDUSTRY GROUP CO LTD | 2011-06-15 | — | — | CN | disclosed |
| CN-101348280-A | Method for preparing electronic grade non-selenium manganomanganic oxide from dialogite | HUNAN ORIENTAL MN INDUSTRY GRO (CN) | 2009-01-21 | — | — | CN | disclosed |
| US-5484517-A | Method of forming multi-element thin hot film sensors on polyimide film | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) | 1996-01-16 | — | — | US | disclosed |
| US-5074969-A | Applying protective nickel alloy coating to current carrying connectors to prevent ionic migration; tape automated bonding | IBM CORPORATION (US) | 1991-12-24 | — | — | US | disclosed |
| EP-0441164-A2 | Composition and coating to prevent current induced electro-chemical dendrite formation between conductors on dielectric substrate | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1991-08-14 | — | — | EP | disclosed |
| US-5038195-A | protective nickel alloy coating to copper leads | IBM (US) | 1991-08-06 | — | — | US | disclosed |