SCHEMBL901114

SCHEMBL901114

C1CC2CC1C1C3CC(C21)C1C2CCC(C2)C31

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29367153 0.89
SCHEMBL13464089 0.89
SCHEMBL30093250 0.89
SCHEMBL15759917 0.86
SCHEMBL23625458 0.83
SCHEMBL2360185 0.81
SCHEMBL14640977 0.81
SCHEMBL14123432 0.81 CYP2C9 (0.30)
SCHEMBL14312378 0.81
SCHEMBL18537523 0.81 ALDH1A1 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2621994-A1 EPOXY RESIN COMPOSITIONS Dow Global Technologies LLC (US) 2013-08-07 EP claimed
WO-2012044443-A1 EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2012-04-05 WO claimed
US-20250326927-A1 CRYSTALLIZABLE RESINS ALIGN TECHNOLOGY INC (US) 2025-10-23 US disclosed
US-12215223-B2 Crystallizable resins ALIGN TECHNOLOGY, INC. (US) 2025-02-04 US disclosed
CN-117616882-A Method for producing circuit board, circuit board precursor with release film, and circuit board precursor with inorganic substrate 东洋纺株式会社 2024-02-27 CN disclosed
CN-115996840-A Laminate and method for manufacturing flexible device 东洋纺株式会社 2023-04-21 CN disclosed
WO-2022114136-A1 POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM, AND POLYIMIDE FILM/SUBSTRATE LAMINATE 宇部興産株式会社 2022-06-02 WO disclosed
US-20160154304-A1 SALT, ACID GENERATOR, RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2016-06-02 US disclosed
EP-2738226-A1 PHOTOCURABLE INK JET INK AND ELECTRONIC CIRCUIT BOARD JNC Corporation (JP) 2014-06-04 EP disclosed