SCHEMBL9013080

SCHEMBL9013080

NC(=O)C1C2C=CC(C2)C1C(=O)Nc1ccccc1

nearest known ligand 0.58

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
POLB P06746 4/20 0.58
ALDH1A1 P00352 5/20 0.57
GAA P10253 4/20 0.57
MEN1 O00255 3/20 0.57
KMT2A Q03164 3/20 0.57
KDM4E B2RXH2 2/20 0.57
L3MBTL1 Q9Y468 1/20 0.57
CASP6 P55212 1/20 0.52
CTDSP1 Q9GZU7 1/20 0.52
F13A1 P00488 1/20 0.50
TGM2 P21980 1/20 0.50
HPGD P15428 3/20 0.49
RAB9A P51151 2/20 0.49
SMN1; SMN2 Q16637 1/20 0.49
TDP1 Q9NUW8 1/20 0.49
NPC1 O15118 2/20 0.48
MAPT P10636 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5862372 0.87 POLB (0.75) POLBALDH1A1GAAMEN1KMT2A
SCHEMBL20705655 0.87 POLB (0.75) POLBALDH1A1GAAMEN1KMT2A
SCHEMBL19425502 0.87 POLB (0.75) POLBALDH1A1GAAMEN1KMT2A
SCHEMBL20969059 0.87 POLB (0.58) POLBALDH1A1GAAMEN1KMT2A
SCHEMBL20897153 0.86 POLB (0.57) POLBALDH1A1GAAMEN1KMT2A
SCHEMBL28032002 0.82 POLB (0.53) POLBALDH1A1GAAMEN1KMT2A
SCHEMBL27636040 0.82 POLB (0.53) POLBALDH1A1GAAMEN1KMT2A
SCHEMBL20897151 0.81 POLB (0.56) POLBALDH1A1GAAMEN1KMT2A
SCHEMBL7599450 0.79 POLB (0.50) POLBALDH1A1GAAMEN1KMT2A
SCHEMBL5121095 0.79 POLB (0.50) POLBALDH1A1GAAMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113840849-B Resin composition, electronic component, and method for producing resin film 日本瑞翁株式会社 2023-03-28 CN disclosed
CN-113396182-B Resin composition, electronic component, and method for producing resin film 日本瑞翁株式会社(JP) 2023-01-13 CN disclosed
CN-113840849-A Resin composition, electronic component, and method for producing resin film 日本瑞翁株式会社 2021-12-24 CN disclosed
CN-113396182-A Resin composition, electronic component, and method for producing resin film 日本瑞翁株式会社 2021-09-14 CN disclosed
CN-113348433-A Membrane touch sensor and method of manufacturing the same 东友精细化工有限公司 2021-09-03 CN disclosed
EP-0577002-B1 Poly(methacryl imides) with elevated heat distortion resistance BASF AG (DE) 1996-12-04 EP disclosed
US-5354814-A Molding materials; heat resistance BASF AKTIENGESELLSCHAFT (DE) 1994-10-11 US disclosed
EP-0577002-A1 Poly(methacryl imides) with elevated heat distortion resistance BASF Aktiengesellschaft (DE) 1994-01-05 EP disclosed