Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 2/20 | 0.56 |
| ▸ | CASP6 | P55212 | 1/20 | 0.56 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.56 |
| ▸ | GAA | P10253 | 5/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.46 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.46 |
| ▸ | KDM1A | O60341 | 1/20 | 0.44 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.42 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.41 |
| ▸ | MEN1 | O00255 | 2/20 | 0.41 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.41 |
| ▸ | MAPT | P10636 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20897168 | 0.89 | POLB (0.50) | POLBCASP6CTDSP1GAATDP1 | |
| SCHEMBL9013080 | 0.81 | POLB (0.58) | POLBCASP6CTDSP1GAATDP1 | |
| SCHEMBL20897153 | 0.77 | POLB (0.57) | POLBGAATDP1ALDH1A1KDM4E | |
| SCHEMBL11851766 | 0.72 | ALOX15 (0.66) | POLBCASP6CTDSP1ALDH1A1KDM4E | |
| SCHEMBL9073184 | 0.72 | ALDH1A1 (0.41) | POLBGAATDP1ALDH1A1KMT2A | |
| SCHEMBL2549326 | 0.72 | ALDH1A1 (0.41) | POLBGAATDP1ALDH1A1KMT2A | |
| SCHEMBL22654023 | 0.72 | TSHR (0.42) | POLBCASP6CTDSP1GAATDP1 | |
| SCHEMBL20969059 | 0.71 | POLB (0.58) | POLBGAATDP1ALDH1A1KDM4E | |
| SCHEMBL15702582 | 0.71 | POLB (0.71) | POLBCASP6CTDSP1GAATDP1 | |
| SCHEMBL251917 | 0.71 | KDM4E (0.44) | POLBCASP6CTDSP1GAATDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240329525-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-10-03 | — | — | US | disclosed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| CN-113820920-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-07-04 | — | — | CN | disclosed |
| CN-113820920-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2021-12-21 | — | — | CN | disclosed |
| CN-107850844-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2021-09-07 | — | — | CN | disclosed |
| CN-107329367-B | Photosensitive resin composition, method for producing cured relief pattern, semiconductor device, and display device | 旭化成株式会社 | 2021-03-23 | — | — | CN | disclosed |
| US-20200409263-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-12-31 | — | — | US | disclosed |
| US-10831101-B2 | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-11-10 | — | — | US | disclosed |
| US-20190113845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-04-18 | — | — | US | disclosed |