SCHEMBL9033503

SCHEMBL9033503

NC(N)(c1ccccc1)c1cc(Cl)c(Cl)c(Cl)c1Cl

nearest known ligand 0.47

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
KCNN4 O15554 3/20 0.47
CYP3A4 P08684 2/20 0.39
TSHR P16473 2/20 0.34
KIF11 P52732 5/20 0.33
HSP90AA1 P07900 2/20 0.32
HPGD P15428 1/20 0.32
HSD17B10 Q99714 1/20 0.32
AHR P35869 3/20 0.31
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31
KCNA3 P22001 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6136339 0.80 TSHR (0.39) KCNN4CYP3A4TSHRKIF11HSP90AA1
SCHEMBL10977818 0.79 KCNN4 (0.43) KCNN4TSHRKIF11
SCHEMBL9417265 0.78 ALDH1A1 (0.38) KCNN4CYP3A4TSHRHSP90AA1HPGD
SCHEMBL28138987 0.78 CYP19A1 (0.41) KCNN4CYP3A4TSHRHSP90AA1HPGD
SCHEMBL14991154 0.78 TSHR (0.38) KCNN4CYP3A4TSHRKIF11HSP90AA1
SCHEMBL9321118 0.77 KCNN4 (0.36) KCNN4CYP3A4TSHRHSP90AA1HPGD
SCHEMBL27459558 0.74 KCNN4 (0.72) KCNN4CYP3A4TSHRKIF11MEN1
SCHEMBL31607641 0.73 KCNN4 (0.59) KCNN4CYP3A4TSHRKIF11MEN1
SCHEMBL699760 0.73 KCNN4 (0.59) KCNN4CYP3A4TSHRKIF11MEN1
SCHEMBL6356860 0.73 CYP2C9 (0.49) KCNN4CYP3A4HPGDMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0161576-B1 EPOXY RESIN COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1990-07-04 EP claimed
US-4663401-A POLYSULFONE POLYETHER BLEND WITH DIAMINE CURING AGENT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1987-05-05 US claimed
EP-0161576-A2 Epoxy resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1985-11-21 EP claimed
JP-55115424-A None JP disclosed
CN-102950550-A Method of manufacturing chemical mechanical polishing layers ROHM & HAAS ELECT MAT 2013-03-06 CN disclosed
CN-101870093-B Method for manufacturing chemical mechanical polishing pad polishing layers having reduced gas inclusion defects ROHM & HAAS ELECT MAT 2012-11-28 CN disclosed
CN-102335498-A Golf ball comprising renewable resource component ACUSHENT COMPANY 2012-02-01 CN disclosed
CN-102266658-A Multilayer golf 2011-12-07 CN disclosed
CN-102166403-A Multilayer core golf ball ACUSHENT COMPANY 2011-08-31 CN disclosed
CN-102166404-A Multilayer core golf ball ACUSHENT COMPANY 2011-08-31 CN disclosed
CN-102166402-A Multilayer core golf ball ACUSHENT COMPANY 2011-08-31 CN disclosed
EP-0273731-A1 Imide compound and composition containing the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1988-07-06 EP disclosed
US-4705833-A POLYIMIDES, EPOXY RESINS SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1987-11-10 US disclosed
US-4663401-A POLYSULFONE POLYETHER BLEND WITH DIAMINE CURING AGENT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1987-05-05 US disclosed
EP-0217657-A2 Low-viscosity epoxy resin, resin composition containing it, and fibre-reinforced composite material containing cured product of the composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1987-04-08 EP disclosed
EP-0214750-A1 Use of imides hardeners for epoxy resins and epoxy resin compositions containing these imides. SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1987-03-18 EP disclosed
EP-0199606-A2 Epoxy resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1986-10-29 EP disclosed
EP-0188337-A2 Thermosettable heat-resistant epoxy resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1986-07-23 EP disclosed
EP-0161576-A2 Epoxy resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1985-11-21 EP disclosed
JP-S55115424-A EPOXY RESIN COMPOSITION FOR LAMINATE SHIN KOBE ELECTRIC MACH CO LTD 1980-09-05 JP disclosed