SCHEMBL9066564

SCHEMBL9066564

C=C(C)C(=O)OCCC[Si](C)(O)[SiH3]

nearest known ligand 0.53

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.53
THRB P10828 1/20 0.46
POLB P06746 1/20 0.41
APEX1 P27695 1/20 0.41
HTT P42858 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
ALDH1A1 P00352 3/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31070809 0.85 TSHR (0.56) TSHRTHRBPOLBAPEX1HTT
SCHEMBL744453 0.85 TSHR (0.56) TSHRTHRBPOLBAPEX1HTT
SCHEMBL932961 0.85 TSHR (0.56) TSHRTHRBPOLBAPEX1HTT
SCHEMBL12095074 0.85 TSHR (0.60) TSHRTHRBPOLBAPEX1HTT
Lithium SCHEMBL8074773 0.84 TSHR (0.55) TSHRTHRBPOLBAPEX1HTT
SCHEMBL79076 0.83 TSHR (0.58) TSHRTHRBPOLBAPEX1HTT
SCHEMBL17373026 0.83 TSHR (0.58) TSHRTHRBPOLBAPEX1HTT
SCHEMBL98210 0.83 TSHR (0.58) TSHRTHRBPOLBAPEX1HTT
SCHEMBL30468107 0.82 TSHR (0.53) TSHRTHRBPOLBAPEX1HTT
SCHEMBL17750831 0.82 TSHR (0.53) TSHRTHRBPOLBAPEX1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0358238-B1 Resin compositions and a method of curing the same KANSAI PAINT CO LTD (JP) 1996-06-05 EP disclosed
US-5492968-A CONTAINS A HIGH MOLECULAR WEIGHT COMPOUND CONTAINING HYDROXY AND EPOXY GROUPS, A SILANE COMPOUND AND A METAL CHELATE COMPOUND KANSAI PAINT COMPANY LIMITED (JP) 1996-02-20 US disclosed
EP-0687712-A2 Resin composition and a method of curing the same KANSAI PAINT CO., LTD. (JP) 1995-12-20 EP disclosed
EP-0682086-A2 Resin composition and a method of curing the same KANSAI PAINT CO., LTD. (JP) 1995-11-15 EP disclosed
EP-0681003-A2 Resin composition and a method of curing the same KANSAI PAINT CO., LTD. (JP) 1995-11-08 EP disclosed
US-5389727-A Low temperature curing, weatherproofing KANSAI PAINT COMPANY, LIMITED (JP) 1995-02-14 US disclosed
US-5284919-A Low temperature curing, waterproofing, acid resistance KANSAI PAINT COMPANY, LIMITED (JP) 1994-02-08 US disclosed
EP-0358238-A2 Resin compositions and a method of curing the same KANSAI PAINT CO., LTD. (JP) 1990-03-14 EP disclosed