SCHEMBL9075473

SCHEMBL9075473

COC(NC(=N)N)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL36898 0.72
SCHEMBL11792719 0.72
Sulfuric Acid SCHEMBL11559577 0.67 KDM4E (0.38)
SCHEMBL1708937 0.67
SCHEMBL2933677 0.67
SCHEMBL22589402 0.67 NOS3 (0.36)
SCHEMBL4103383 0.67 CA14 (0.46)
SCHEMBL14093943 0.67
Hydrochloric Acid SCHEMBL4419382 0.65
Hydrochloric Acid SCHEMBL9034919 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0475127-B1 Polyacetal resin composition having high-temperature stiffness ASAHI CHEMICAL IND (JP) 1996-03-13 EP disclosed
US-5354798-A Polyamide, dispersant and filler ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1994-10-11 US disclosed
EP-0475127-A1 Polyacetal resin composition having high-temperature stiffness ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1992-03-18 EP disclosed