SCHEMBL9101320

SCHEMBL9101320

CCCCC(C1CCO1)C(O[SiH3])(C(CCCC)C1CCO1)C(CCCC)C1CCO1

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.34
ALDH1A1 P00352 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27922172 0.74
SCHEMBL28328095 0.72
SCHEMBL14991187 0.70
SCHEMBL3382030 0.69 EPHX1 (0.39) EPHX1ALDH1A1SMN1; SMN2
SCHEMBL3381478 0.67 ALDH1A1 (0.40) EPHX1ALDH1A1SMN1; SMN2
SCHEMBL9101310 0.67
SCHEMBL3379488 0.65 EPHX1 (0.42) EPHX1ALDH1A1SMN1; SMN2
SCHEMBL27922216 0.64 EPHX1 (0.35) EPHX1ALDH1A1SMN1; SMN2
SCHEMBL28010981 0.63 SMN1; SMN2 (0.41) EPHX1ALDH1A1SMN1; SMN2
SCHEMBL2517670 0.63 EPHX1 (0.34) EPHX1ALDH1A1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10591816-B2 Photosensitive resin composition, color filter, and liquid crystal display element thereof CHI MEI CORPORATION (TW) 2020-03-17 US disclosed
US-10162260-B2 Photosensitive resin composition, protective film, and liquid crystal display element CHI MEI CORPORATION (TW) 2018-12-25 US disclosed
US-20170235224-A1 PHOTOSENSITIVE RESIN COMPOSITION, COLOR FILTER, AND LIQUID CRYSTAL DISPLAY ELEMENT THEREOF CHI MEI CORPORATION (TW) 2017-08-17 US disclosed
US-20170168390-A1 PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT CHI MEI CORPORATION (TW) 2017-06-15 US disclosed
US-9541832-B2 Photosensitive resin composition, protective film and element having the same CHI MEI CORPORATION (TW) 2017-01-10 US disclosed
US-9507261-B2 Photosensitive composition, protective film, and element having the protective film CHI MEI CORPORATION (TW) 2016-11-29 US disclosed
US-20160291470-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION, PROTECTING FILM, AND ELEMENT HAVING PROTECTIVE FILM CHI MEI CORPORATION (TW) 2016-10-06 US disclosed
US-9395627-B2 Positive photosensitive resin composition and method for forming pattern by using the same CHI MEI CORPORATION 2016-07-19 US disclosed
US-9389509-B2 Photosensitive polysiloxane composition, protecting film and element having the protecting film CHI MEI CORPORATION (TW) 2016-07-12 US disclosed
US-20160179004-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION, PROTECTING FILM, AND ELEMENT HAVING PROTECTIVE FILM CHI MEI CORPORATION (TW) 2016-06-23 US disclosed
US-8722755-B2 Photosensitive resin composition and uses thereof CHI MEI CORPORATION (TW) 2014-05-13 US disclosed
US-20130310497-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATIONS THEREOF CHI MEI CORPORATION (TW) 2013-11-21 US disclosed
US-20130299755-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR A COLOR FILTER AND USES THEREOF CHI MEI CORPORATION (TW) 2013-11-14 US disclosed
US-20130280541-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2013-10-24 US disclosed
US-20130260108-A1 PHOTO-CURING POLYSILOXAN COMPOSITION AND APPLICATIONS THEREOF CHI MEI CORPORATION (TW) 2013-10-03 US disclosed
US-8546061-B2 Photo-curing polysiloxane composition and protective film formed from the same CHI MEI CORPORATION (TW) 2013-10-01 US disclosed
US-20130245150-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2013-09-19 US disclosed
US-20130142966-A1 BLUE PHOTOSENSITIVE RESIN COMPOSITION FOR COLOR FILTERS AND USES THEREOF CHI MEI CORPORATION (TW) 2013-06-06 US disclosed
US-20130144005-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2013-06-06 US disclosed
US-20120141936-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND PROTECTIVE FILM FORMED FROM THE SAME CHI MEI CORPORATION (TW) 2012-06-07 US disclosed