SCHEMBL9101438

SCHEMBL9101438

CC(C)(C)CC(=O)OC1CCC(OC(=O)CC(C)(C)C)CC1

nearest known ligand 0.44

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
APOBEC3A P31941 1/20 0.44
APOBEC3G Q9HC16 1/20 0.44
HTT P42858 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
KDM4E B2RXH2 1/20 0.42
CYP19A1 P11511 6/20 0.41
NAAA Q02083 2/20 0.40
MAPT P10636 2/20 0.38
GAA P10253 1/20 0.38
CYP2C19 P33261 1/20 0.36
EPHX1 P07099 2/20 0.34
ALDH1A1 P00352 1/20 0.32
MIF P14174 1/20 0.32
EPHX2 P34913 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8716143 0.92 SMYD3 (0.40) APOBEC3AAPOBEC3GHTTSMN1; SMN2KDM4E
SCHEMBL17819382 0.92 CYP19A1 (0.47) APOBEC3AAPOBEC3GHTTSMN1; SMN2KDM4E
SCHEMBL291275 0.90 NAAA (0.51) APOBEC3AAPOBEC3GHTTSMN1; SMN2KDM4E
SCHEMBL23518510 0.89 APOBEC3A (0.38) APOBEC3AAPOBEC3GHTTSMN1; SMN2KDM4E
Acetic Acid SCHEMBL28606205 0.85 NAAA (0.47) APOBEC3AAPOBEC3GHTTSMN1; SMN2KDM4E
SCHEMBL7399719 0.85 CYP19A1 (0.36) APOBEC3AAPOBEC3GHTTSMN1; SMN2KDM4E
SCHEMBL23518498 0.80 APOBEC3A (0.33) APOBEC3AAPOBEC3GHTTSMN1; SMN2KDM4E
SCHEMBL23487957 0.78 NAAA (0.46) APOBEC3AAPOBEC3GHTTSMN1; SMN2KDM4E
SCHEMBL4781362 0.78 CYP19A1 (0.37) APOBEC3AAPOBEC3GHTTSMN1; SMN2CYP19A1
SCHEMBL28458200 0.78 CYP2C19 (0.32) CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2460854-B1 ELECTROPLATABLE ARTICLE MADE OF A RUBBER-MODIFIED POLYSTYRENE RESIN COMPOSITION CHI MEI CORP (TW) 2016-11-16 EP disclosed
US-8835559-B2 Rubber-modified polystyrene resin composition for making an electroplatable article CHI MEI CORPORATION (TW) 2014-09-16 US disclosed
US-20120142862-A1 RUBBER-MODIFIED POLYSTYRENE RESIN COMPOSITION FOR MAKING AN ELECTROPLATABLE ARTICLE CHI MEI CORPORATION (TW) 2012-06-07 US disclosed
EP-2460854-A1 Rubber-modified polystyrene resin composition for making an electroplatable article Chi Mei Corporation (TW) 2012-06-06 EP disclosed