SCHEMBL9101514

SCHEMBL9101514

CCCC(CC(CCCCCOCC(CC)C1CCO1)(CCCCCOCC(CC)C1CCO1)CO[SiH3])C1CCO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30163452 0.72
SCHEMBL27860181 0.71 SMN1; SMN2 (0.30)
SCHEMBL27922167 0.70
SCHEMBL3382037 0.69 ALDH1A1 (0.32)
SCHEMBL3381889 0.68 ALDH1A1 (0.30)
SCHEMBL9101310 0.68
SCHEMBL28305459 0.66 ALDH1A1 (0.51)
SCHEMBL1526871 0.66
SCHEMBL3377268 0.66 SMN1; SMN2 (0.36)
SCHEMBL28010981 0.65 SMN1; SMN2 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10162260-B2 Photosensitive resin composition, protective film, and liquid crystal display element CHI MEI CORPORATION (TW) 2018-12-25 US disclosed
US-9851638-B2 Photosensitive polysiloxane composition and uses thereof CHI MEI CORPORATION (TW) 2017-12-26 US disclosed
US-20170168390-A1 PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT CHI MEI CORPORATION (TW) 2017-06-15 US disclosed
US-20170023860-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF CHI MEI CORP (TW) 2017-01-26 US disclosed
US-9541832-B2 Photosensitive resin composition, protective film and element having the same CHI MEI CORPORATION (TW) 2017-01-10 US disclosed
US-9507261-B2 Photosensitive composition, protective film, and element having the protective film CHI MEI CORPORATION (TW) 2016-11-29 US disclosed
US-9395627-B2 Positive photosensitive resin composition and method for forming pattern by using the same CHI MEI CORPORATION 2016-07-19 US disclosed
US-9389509-B2 Photosensitive polysiloxane composition, protecting film and element having the protecting film CHI MEI CORPORATION (TW) 2016-07-12 US disclosed
US-9298091-B2 Photosensitive resin composition and uses thereof CHI MEI CORPORATION (TW) 2016-03-29 US disclosed
US-20150378256-A1 PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM AND ELEMENT HAVING THE SAME CHI MEI CORPORATION (TW) 2015-12-31 US disclosed
US-8722755-B2 Photosensitive resin composition and uses thereof CHI MEI CORPORATION (TW) 2014-05-13 US disclosed
US-20130310497-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATIONS THEREOF CHI MEI CORPORATION (TW) 2013-11-21 US disclosed
US-20130299755-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR A COLOR FILTER AND USES THEREOF CHI MEI CORPORATION (TW) 2013-11-14 US disclosed
US-20130280541-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2013-10-24 US disclosed
US-20130260108-A1 PHOTO-CURING POLYSILOXAN COMPOSITION AND APPLICATIONS THEREOF CHI MEI CORPORATION (TW) 2013-10-03 US disclosed
US-8546061-B2 Photo-curing polysiloxane composition and protective film formed from the same CHI MEI CORPORATION (TW) 2013-10-01 US disclosed
US-20130245150-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2013-09-19 US disclosed
US-20130142966-A1 BLUE PHOTOSENSITIVE RESIN COMPOSITION FOR COLOR FILTERS AND USES THEREOF CHI MEI CORPORATION (TW) 2013-06-06 US disclosed
US-20130144005-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2013-06-06 US disclosed
US-20120141936-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND PROTECTIVE FILM FORMED FROM THE SAME CHI MEI CORPORATION (TW) 2012-06-07 US disclosed