SCHEMBL91216

SCHEMBL91216

OC(CC1CC=CCC1)(C(F)(F)F)C(F)(F)F

nearest known ligand 0.35

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
NPSR1 Q6W5P4 1/20 0.33
KDM4E B2RXH2 4/20 0.33
HSD17B10 Q99714 1/20 0.33
TDP1 Q9NUW8 2/20 0.31
ALDH1A1 P00352 2/20 0.31
PKM P14618 1/20 0.31
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13929998 0.86
SCHEMBL9926596 0.81 KDM4E (0.33) NPSR1KDM4EHSD17B10TDP1ALDH1A1
SCHEMBL1524655 0.73 KDM4E (0.35) NPSR1KDM4EHSD17B10TDP1ALDH1A1
SCHEMBL23319670 0.70 KDM4E (0.40) KDM4EHSD17B10TDP1ALDH1A1PKM
SCHEMBL14209302 0.70 CYP1A2 (0.31)
SCHEMBL75027 0.69 CYP1A2 (0.34)
SCHEMBL13406438 0.68 KDM4E (0.33) NPSR1KDM4EHSD17B10TDP1ALDH1A1
SCHEMBL7873210 0.68
SCHEMBL628623 0.68
SCHEMBL1525295 0.68 ALDH1A1 (0.36) NPSR1KDM4EHSD17B10TDP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8211618-B2 Positive resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-07-03 US disclosed
US-8198016-B2 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-06-12 US disclosed
US-8129100-B2 Double patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-03-06 US disclosed
US-8101341-B2 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-01-24 US disclosed
US-20100304297-A1 PATTERNING PROCESS AND RESIST COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-12-02 US disclosed
US-20100227273-A1 POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-09-09 US disclosed
US-20100178617-A1 PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-07-15 US disclosed
US-20100159404-A1 PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-06-24 US disclosed
US-20100159392-A1 PATTERNING PROCESS AND RESIST COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-06-24 US disclosed
US-7700262-B2 Top coat material and use thereof in lithography processes INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-04-20 US disclosed
WO-2008121804-A1 USE OF A COMBINATION CHAIN TRANSFER AND ACTIVATING AGENT TO CONTROL MOLECULAR WEIGHT AND OPTICAL DENSITY OF PD CATALYZED NORBORNENE POLYMERS PROMERUS LLC (US) 2008-10-09 WO disclosed
US-20080241736-A1 Immersion lithography; copolymer containing ammonium salt of carboxylic acid and fluorine monomer SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-10-02 US disclosed
US-20080220381-A1 Antireflection film composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-09-11 US disclosed
US-20080166568-A1 TOP COAT MATERIAL AND USE THEREOF IN LITHOGRAPHY PROCESSES INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-07-10 US disclosed
US-7368218-B2 Positive resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-05-06 US disclosed
US-20080096131-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2008-04-24 US disclosed
US-7341818-B2 Norbornene-type monomers and polymers containing pendent lactone or sultone groups PROMERUS LLC (US) 2008-03-11 US disclosed
US-7332616-B2 Polymerizable compound, polymer, positive-resist composition, and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-02-19 US disclosed
US-20080038676-A1 TOP COAT MATERIAL AND USE THEREOF IN LITHOGRAPHY PROCESSES INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-02-14 US disclosed
US-20080020290-A1 Negative resist composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-01-24 US disclosed