SCHEMBL916134

SCHEMBL916134

O[Si](O)(O)O.[CaH2].[Ti]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28745594 1.00
SCHEMBL3486966 0.91
SCHEMBL5692214 0.91
SCHEMBL8006469 0.91
SCHEMBL42404 0.91
SCHEMBL9776951 0.91
SCHEMBL935083 0.91
SCHEMBL15676633 0.91
SCHEMBL3579 0.91
SCHEMBL9133884 0.91

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022190062-A1 ANTIBACTERIAL AND VIRUCIDAL PREPARATION FOR AMORPHOUS OR CRYSTALLINE SURFACES, COMPOSITION THAT CONTAINS IT AND RELATED USE SICER S.P.A. (IT) 2022-09-15 WO claimed
CN-107304130-B Dielectric composition, dielectric ceramic, and capacitor TDK株式会社 2021-03-09 CN claimed
CN-107304130-A Dielectric composition, dielectric ceramics and capacitor TDK株式会社 2017-10-31 CN claimed
US-20250256971-A1 Compositions and Methods for the Capture of Carbon Dioxide and/or the Generation of Silica OHIO STATE INNOVATION FOUNDATION 2025-08-14 US disclosed
US-12168747-B2 Aerogel compositions for high temperature applications ASPEN AEROGELS, INC. (US) 2024-12-17 US disclosed
US-20240360363-A1 AEROGEL COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS ASPEN AEROGELS, INC. 2024-10-31 US disclosed
CN-118373637-A Anti-freezing baking-free brick prepared from drilling mud cake and preparation method thereof 濮阳天地人环保科技股份有限公司 2024-07-23 CN disclosed
US-11634641-B2 Aerogel compositions for high temperature applications ASPEN AEROGELS, INC. (US) 2023-04-25 US disclosed
US-11549059-B2 Aerogel compositions with enhanced performance MIDCAP FUNDING IV TRUST 2023-01-10 US disclosed
US-11261380-B2 Aerogel compositions for high temperature applications MIDCAP FUNDING IV TRUST 2022-03-01 US disclosed
US-20210207032-A1 AEROGEL COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS ASPEN AEROGELS, INC. (US) 2021-07-08 US disclosed
US-5874375-A MELT BLOWN/MELT SPUN FIBER FOR HEAT OR ACOUSTIC INSULATION MATERIAL HAVING LOW FRIABILITY, LOW SHRINKAGE FIBER YET BEING SOLUBLE IN PHYSIOLOGICAL FLUIDS (I.E., LUNG FLUID); NONTOXIC UNIFRAX CORPORATION (US) 1999-02-23 US disclosed
US-5801108-A Low temperature cofireable dielectric paste MOTOROLA INC. (US) 1998-09-01 US disclosed
CN-1172466-A High temperature resistant glass fiber UNIFRAX CORP (US) 1998-02-04 CN disclosed
EP-0804391-A1 HIGH TEMPERATURE RESISTANT GLASS FIBER UNIFRAX CORPORATION (US) 1997-11-05 EP disclosed
WO-1997016386-A1 HIGH TEMPERATURE RESISTANT GLASS FIBER UNIFRAX CORPORATION (US) 1997-05-09 WO disclosed
US-5346720-A Palladium thick film resistor containing boron nitride MOTOROLA, INC. (US) 1994-09-13 US disclosed
US-5281389-A Vaporizable liquid vehicle, sinterable palladium powder dispersed in vehicle, titanium dioxide, strontium calcium titanate compound MOTOROLA, INC. (US) 1994-01-25 US disclosed
US-5250358-A Palladium thick film resistor containing boron nitride MOTOROLA, INC. (US) 1993-10-05 US disclosed
US-3996332-A OXIDATION TO TITANIUM DIOXIDE, TITANIUM PYROPHOSPHATE FLUX; AGING THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE INTERIOR (US) 1976-12-07 US disclosed