SCHEMBL919009

SCHEMBL919009

C[Pt](C)/C1=C/C=C\CCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL919011 1.00
SCHEMBL7711207 0.78
SCHEMBL3056765 0.78
SCHEMBL14859626 0.71
SCHEMBL1006515 0.70
SCHEMBL1006517 0.70
SCHEMBL11593478 0.70 ALDH1A1 (0.30)
SCHEMBL11789408 0.70 ALDH1A1 (0.30)
SCHEMBL1999637 0.69
SCHEMBL1999636 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12637604-B2 Silicon-containing thermally conductive pastes WACKER CHEMIE AG (DE) 2026-05-26 US disclosed
US-20250019585-A1 ALUMINUM-CONTAINING THERMAL PASTES WACKER CHEMIE AG (DE) 2025-01-16 US disclosed
EP-4469519-A1 ALUMINUM-CONTAINING THERMAL PASTES Wacker Chemie AG (DE) 2024-12-04 EP disclosed
US-20240309258-A1 SILICON-CONTAINING THERMALLY CONDUCTIVE PASTES WACKER CHEMIE AG (DE) 2024-09-19 US disclosed
EP-4284865-B1 SILICON-CONTAINING THERMALLY CONDUCTIVE PASTES WACKER CHEMIE AG (DE) 2024-07-24 EP disclosed
WO-2023143728-A1 ALUMINUM-CONTAINING THERMAL PASTES WACKER CHEMIE AG (DE) 2023-08-03 WO disclosed
EP-4077491-B1 SILICONE PARTICLES WITH A CROSS-LINKED CORE AND PREPARATION THEREOF WACKER CHEMIE AG (DE) 2023-06-14 EP disclosed
US-20230029365-A1 SILICONE PARTICLES WITH A CROSS-LINKED CORE AND PREPARATION THEREOF WACKER CHEMIE AG (DE) 2023-01-26 US disclosed
US-10696846-B2 Siloxane resin compositions WACKER CHEMIE AG (DE) 2020-06-30 US disclosed
US-10655014-B2 Siloxane resin compositions WACKER CHEMIE AG (DE) 2020-05-19 US disclosed
US-20150315347-A1 PRODUCTION OF THIN SILICONE FILMS WACKER CHEMIE AG (DE) 2015-11-05 US disclosed
US-20140205930-A1 CATALYST PRODUCTION METHOD, ELECTRODE CATALYST FOR FUEL CELL PRODUCED BY THIS METHOD, AND CATALYST PRODUCTION APPARATUS TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) 2014-07-24 US disclosed
US-8404163-B2 Method for producing molded article HITACHI MAXWELL, LTD. (JP) 2013-03-26 US disclosed
WO-2013030652-A1 CATALYST PRODUCTION METHOD, ELECTRODE CATALYST FOR FUEL CELL PRODUCED BY THIS METHOD, AND CATALYST PRODUCTION APPARATUS TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) 2013-03-07 WO disclosed
US-20110104380-A1 METHOD FOR PRODUCING MOLDED ARTICLE HITACHI MAXELL, LTD. (JP) 2011-05-05 US disclosed
US-20110020550-A1 PROCESS FOR PRODUCING COMPOSITE MATERIAL COMPRISING RESIN MOLDED PRODUCT HITACHI MAXELL, LTD. (JP) 2011-01-27 US disclosed
EP-2270256-A2 Method for producing polymer member having plated film Hitachi Maxell, Ltd. (JP) 2011-01-05 EP disclosed
US-20100320635-A1 METHOD FOR PRODUCING POLYMER MEMBER HAVING PLATED FILM HITACHI MAXELL, LTD (JP) 2010-12-23 US disclosed
US-7758923-B2 Impregnating a pressurized fluid containing a metal complex intothe thermoplastic resin melt on one side and molding the into a film; thermic reduction of the complex to deposit the metal fine particles on the surface of the resin; controlling depth; uniformity; automobile headlight reflectors HITACHI MAXELL LTD. (JP) 2010-07-20 US disclosed
US-20070190310-A1 Impregnating a pressurized fluid containing a metal complex intothe thermoplastic resin melt on one side and molding the into a film; thermic reduction of the complex to deposit the metal fine particles on the surface of the resin; controlling depth; uniformity; automobile headlight reflectors HITACHI MAXELL, LTD. (JP) 2007-08-16 US disclosed