SCHEMBL9290002

SCHEMBL9290002

COc1ccc(C(C)(C)c2ccc(OCC3CO3)cc2)cc1

nearest known ligand 0.88

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.88
TP53 P04637 3/20 0.88
TSHR P16473 3/20 0.88
MAPT P10636 3/20 0.88
HPGD P15428 2/20 0.88
MEN1 O00255 2/20 0.88
KMT2A Q03164 2/20 0.88
HIF1A Q16665 2/20 0.88
CYP1A2 P05177 1/20 0.88
PPARG P37231 1/20 0.88
PKM P14618 2/20 0.62
TDP1 Q9NUW8 2/20 0.53
LMNA P02545 1/20 0.50
GAA P10253 1/20 0.50
SMN1; SMN2 Q16637 2/20 0.47
CYP3A4 P08684 1/20 0.47
DRD4 P21917 4/20 0.46
GRM2 Q14416 3/20 0.42
GLA P06280 1/20 0.41
PTPN1 P18031 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12968041 0.96 ALDH1A1 (0.80) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL13317132 0.94 ALDH1A1 (1.00) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL17925477 0.94 ALDH1A1 (1.00) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL22121 0.94 ALDH1A1 (1.00) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL12440176 0.94 ALDH1A1 (1.00) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL12065399 0.94 ALDH1A1 (1.00) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL31392960 0.94 ALDH1A1 (1.00) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL15386739 0.89 ALDH1A1 (0.90) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL8140261 0.89 ALDH1A1 (0.90) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL15934083 0.89 ALDH1A1 (0.90) ALDH1A1TP53TSHRMAPTHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230383114-A1 Cured Epoxy Resin Composition Suitable for Electronic Device Enclosure, Articles, and Methods 3M INNOVATIVE PROPERTIES COMPANY (US) 2023-11-30 US disclosed
US-11773254-B2 Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods 3M INNOVATIVE PROPERTIES COMPANY (US) 2023-10-03 US disclosed
US-11039541-B2 Double-sided and multilayered printed circuit board fabrication using inkjet printing NANO DIMENSION TECHNOLOGIES, LTD. (IL) 2021-06-15 US disclosed
EP-2977099-B1 METHOD FOR FORMING A MEMBRANE FILTER MADE OF PHOTOSENSITIVE MATERIAL TOKYO OHKA KOGYO CO LTD (JP) 2020-06-03 EP disclosed
US-10626233-B2 Suspension polymerization compositions, methods and uses thereof Nano-Dimension Technologies, Ltd. (IL) 2020-04-21 US disclosed
US-10385175-B2 Uspension polymerization compositions, methods and uses thereof NANO DIMENSION TECHNOLOGIES, LTD. (IL) 2019-08-20 US disclosed
US-20190098771-A1 DOUBLE-SIDED AND MULTILAYERED PRINTED CIRCUIT BOARD FABRICATION USING INKJET PRINTING NANO DIMENSION TECHNOLOGIES, LTD. (IL) 2019-03-28 US disclosed
US-9947480-B2 Electrolyte material formulation, electrolyte material composition formed therefrom and use thereof ETERNAL MATERIALS CO., LTD. (TW) 2018-04-17 US disclosed
US-20180100043-A1 UNIDIRECTIONAL PREPREG, FIBER-REINFORCED THERMOPLASTIC RESIN SHEET, MANUFACTURING METHODS OF UNIDIRECTIONAL PREPREG AND FIBER-REINFORCED THERMOPLASTIC RESIN SHEET, AND MOLDED BODY Suncorona Oda Co., Ltd. (JP) 2018-04-12 US disclosed
US-20180100043-A1 UNIDIRECTIONAL PREPREG, FIBER-REINFORCED THERMOPLASTIC RESIN SHEET, MANUFACTURING METHODS OF UNIDIRECTIONAL PREPREG AND FIBER-REINFORCED THERMOPLASTIC RESIN SHEET, AND MOLDED BODY Suncorona Oda Co., Ltd. (JP) 2018-04-12 US disclosed
US-7388044-B2 Coatings with enhanced water-barrier and anti-corrosive properties HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2008-06-17 US disclosed
WO-2008040648-A1 SULPHONIUM SALT PHOTOINITIATORS CIBA HOLDING INC. (CH) 2008-04-10 WO disclosed
US-20080050596-A1 Flame-Retardant Epoxy Resin Composition ASAHI KASEI CHEMICALS CORPORATION (JP) 2008-02-28 US disclosed
US-20070256301-A1 METHOD OF MANUFACTURING INKJET PRINTHEAD USING CROSSLINKED POLYMER SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-11-08 US disclosed
US-7270879-B2 Particulate material containing thermoplastics and methods for making and using the same HEXION SPECIALTY CHEMICALS, INC. (US) 2007-09-18 US disclosed
US-20070191512-A1 Process for obtaining aqueous compositions comprising curing epoxy agents GABRIEL PERFORMANCE PRODUCTS, LLC 2007-08-16 US disclosed
EP-0909288-B1 PROCESS FOR CURING A POLYMERIZABLE COMPOSITION CIBA SC HOLDING AG (CH) 2007-06-27 EP disclosed
EP-1311627-B1 PROCESS FOR PRODUCING COATINGS USING SURFACE-ACCUMULATING PHOTOINITIATORS CIBA SC HOLDING AG (CH) 2007-04-25 EP disclosed
US-20070034515-A1 Radiation- or thermally-curable oxetane barrier sealants HENKEL AG & CO. KGAA (DE) 2007-02-15 US disclosed
WO-2007003507-A1 SULPHONIUM SALT INITIATORS CIBA SPECIALTY CHEMICALS HOLDING INC. (CH) 2007-01-11 WO disclosed