SCHEMBL9305769

SCHEMBL9305769

c1ccc(CCCCCCCCCC(OC(CCCCCCCCCc2ccccc2)c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.49

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
KCNH2 Q12809 1/20 0.46
SIGMAR1 Q99720 8/20 0.46
CYP19A1 P11511 1/20 0.44
TRPA1 O75762 1/20 0.44
MAOA P21397 1/20 0.44
MAPT P10636 1/20 0.43
RXFP1 Q9HBX9 1/20 0.43
S1PR2 O95136 1/20 0.43
S1PR4 O95977 1/20 0.43
S1PR1 P21453 1/20 0.43
S1PR3 Q99500 1/20 0.43
HTR2A P28223 1/20 0.42
MAOB P27338 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10717425 1.00 KCNH2 (0.46) KCNH2SIGMAR1CYP19A1TRPA1MAOA
SCHEMBL9659732 1.00 KCNH2 (0.46) KCNH2SIGMAR1CYP19A1TRPA1MAOA
SCHEMBL28902075 0.84 IDO1 (0.50) KCNH2SIGMAR1CYP19A1HTR2A
SCHEMBL28394982 0.82 TRPA1 (0.42) KCNH2SIGMAR1CYP19A1TRPA1MAOA
SCHEMBL9371119 0.82 KCNH2 (0.44) KCNH2SIGMAR1CYP19A1TRPA1MAPT
SCHEMBL9304152 0.80 KCNH2 (0.41) KCNH2SIGMAR1CYP19A1TRPA1MAOA
SCHEMBL8048483 0.79 HTR2A (0.44) KCNH2SIGMAR1CYP19A1HTR2A
SCHEMBL3219880 0.79 HTR2A (0.44) KCNH2SIGMAR1CYP19A1HTR2A
SCHEMBL7448877 0.79 HTR2A (0.44) KCNH2SIGMAR1CYP19A1HTR2A
SCHEMBL9168419 0.79 HTR2A (0.44) KCNH2SIGMAR1CYP19A1HTR2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116446175-A Flame-retardant composite material and preparation method thereof 北京爱思达航天科技有限公司 2023-07-18 CN disclosed
CN-114430752-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2022-05-03 CN disclosed
US-5300550-A Thermoplastic resins, low molecular weight additve and carrier BAYER AKTIENGESELLSCHAFT (DE) 1994-04-05 US disclosed