SCHEMBL9317330

SCHEMBL9317330

N=C=O.N=C=O.N=C=O.N=C=O.OCC(CO)(CO)CO

nearest known ligand 0.37

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.37
TSHR P16473 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28613355 1.00 ALDH1A1 (0.37) ALDH1A1TSHR
SCHEMBL9014118 1.00 ALDH1A1 (0.37) ALDH1A1TSHR
SCHEMBL313895 0.82 ALDH1A1 (0.30) ALDH1A1TSHR
SCHEMBL2480469 0.82 ALDH1A1 (0.30) ALDH1A1TSHR
SCHEMBL1856579 0.82 ALDH1A1 (0.30) ALDH1A1TSHR
SCHEMBL28482193 0.80 ALDH1A1 (0.32) ALDH1A1
Methyl Alcohol SCHEMBL28262748 0.80
Methane SCHEMBL27845715 0.80
SCHEMBL28726882 0.76 ALDH1A1 (0.47) ALDH1A1TSHR
SCHEMBL29000807 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1123919-C Pressure-sensitive adhesive tape for manufacturing semiconductor wafer CHANGXING CHEMICAL INDUSTRY CO (CN) 2003-10-08 CN disclosed
CN-1264161-A Pressure-sensitive adhesive tape for manufacturing semiconductor wafer CHANGXING CHEMICAL INDUSTRY CO (CN) 2000-08-23 CN disclosed
US-H1341-H Consists of polyethylene glycol, cellulose esters, nitroglycerine, hexamethylenediamine trimer, cure catalyst bismuth compound, oxidizer perchlorate, stabilizer and metal selected from aluminum, boron and beryllium Hughes, Charles W. (US) 1994-08-02 US disclosed