Fluoride Ion

Fluoride Ion

SCHEMBL9328244

CCCC[n+]1ccc(N(C)C)cc1.[F-]

nearest known ligand 0.70

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Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CHKA P35790 9/20 0.70
KDM4A O75164 2/20 0.60
KDM2A Q9Y2K7 2/20 0.60
MEN1 O00255 1/20 0.50
TP53 P04637 1/20 0.50
CYP1A2 P05177 1/20 0.50
CYP2D6 P10635 1/20 0.50
MAPT P10636 1/20 0.50
CYP2C9 P11712 1/20 0.50
CYP2C19 P33261 1/20 0.50
KMT2A Q03164 1/20 0.50
HTT P42858 5/20 0.48
LMNA P02545 4/20 0.48
SMN1; SMN2 Q16637 4/20 0.48
ALDH1A1 P00352 2/20 0.48
NPC1 O15118 2/20 0.48
RAB9A P51151 2/20 0.48
KDM4E B2RXH2 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2859572 0.98 CHKA (0.73) CHKAKDM4AKDM2AMEN1TP53
Bromide SCHEMBL3044518 0.96 CHKA (0.77) CHKAKDM4AKDM2AMEN1TP53
Hydrochloric Acid SCHEMBL6115253 0.96 CHKA (0.70) CHKAKDM4AKDM2AMEN1TP53
Fluoride Ion SCHEMBL21758528 0.94 CHKA (0.74) CHKAKDM4AKDM2AMEN1TP53
Fluoride Ion SCHEMBL21758539 0.92 CHKA (0.78) CHKAKDM4AKDM2AMEN1TP53
SCHEMBL3431533 0.92 CHKA (0.77) CHKAKDM4AKDM2AMEN1TP53
SCHEMBL23016755 0.90 CHKA (0.81) CHKAKDM4AKDM2AMEN1TP53
SCHEMBL17817509 0.90 CHKA (0.81) CHKAKDM4AKDM2AMEN1TP53
SCHEMBL1108055 0.90 CHKA (0.81) CHKAKDM4AKDM2AMEN1TP53
SCHEMBL9329669 0.90 CHKA (0.81) CHKAKDM4AKDM2AMEN1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0398358-B1 Aluminum electroplating method MITSUBISHI PETROCHEMICAL CO (JP) 1994-03-09 EP claimed
US-5041194-A Using low melting mixture of aluminum halide and onium halide of nitrogen-containing compound MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1991-08-20 US claimed
EP-0398358-A2 Aluminum electroplating method MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1990-11-22 EP claimed
EP-0404188-B1 Non-aqueous electrolytic aluminum plating bath composition NISSHIN STEEL CO LTD (JP) 1994-03-16 EP disclosed
EP-0398358-B1 Aluminum electroplating method MITSUBISHI PETROCHEMICAL CO (JP) 1994-03-09 EP disclosed
US-5074973-A Mixed melt containing aluminum halide, nitrogen-heterocyclic halides, additives, organic polymer NISSHIN STEEL CO. LTD. (JP) 1991-12-24 US disclosed
US-5041194-A Using low melting mixture of aluminum halide and onium halide of nitrogen-containing compound MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1991-08-20 US disclosed
EP-0404188-A1 Non-aqueous electrolytic aluminum plating bath composition NISSHIN STEEL CO., LTD. (JP) 1990-12-27 EP disclosed
EP-0398358-A2 Aluminum electroplating method MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1990-11-22 EP disclosed