SCHEMBL9357752

SCHEMBL9357752

F[SiH](F)[SiH](F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5087461 0.55
SCHEMBL5134016 0.45
SCHEMBL8023481 0.45
SCHEMBL15271759 0.32
SCHEMBL110 0.32
SCHEMBL10005363 0.32
SCHEMBL175898 0.32
SCHEMBL14086857 0.32
SCHEMBL13088830 0.26
SCHEMBL18053585 0.26

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4748968-A1 METHOD FOR FORMING THIN FILM USING TWO TYPES OF SILICON PRECURSOR COMPOUNDS Hansol Chemical Co., Ltd (KR) 2026-05-27 EP claimed
EP-4667616-A1 METHOD FOR THE FORMATION OF THIN FILMS USING TWO TYPES OF SILICON PRECURSOR Hansol Chemical Co., Ltd (KR) 2025-12-24 EP claimed
US-20250369114-A1 METHOD FOR THE FORMATION OF THIN FILMS USING TWO TYPES OF SILICON PRECURSOR HANSOL CHEMICAL CO LTD (KR) 2025-12-04 US claimed
WO-2025018802-A1 METHOD FOR FORMING THIN FILM USING TWO TYPES OF SILICON PRECURSOR COMPOUNDS 주식회사 한솔케미칼 2025-01-23 WO claimed
US-11784026-B2 Substrate processing apparatus, material layer deposition apparatus, and atmospheric pressure chemical vapor deposition apparatus SAMSUNG ELECTRONICS CO., LTD. 2023-10-10 US claimed
US-20210222300-A1 SUBSTRATE PROCESSING APPARATUS, MATERIAL LAYER DEPOSITION APPARATUS, AND ATMOSPHERIC PRESSURE CHEMICAL VAPOR DEPOSITION APPARATUS SAMSUNG ELECTRONICS CO., LTD. (KR) 2021-07-22 US claimed
JP-6110197-A None JP disclosed
EP-4748968-A1 METHOD FOR FORMING THIN FILM USING TWO TYPES OF SILICON PRECURSOR COMPOUNDS Hansol Chemical Co., Ltd (KR) 2026-05-27 EP disclosed
EP-4667616-A1 METHOD FOR THE FORMATION OF THIN FILMS USING TWO TYPES OF SILICON PRECURSOR Hansol Chemical Co., Ltd (KR) 2025-12-24 EP disclosed
US-20250369114-A1 METHOD FOR THE FORMATION OF THIN FILMS USING TWO TYPES OF SILICON PRECURSOR HANSOL CHEMICAL CO LTD (KR) 2025-12-04 US disclosed
US-20250158027-A1 NEGATIVE ELECTRODE ACTIVE MATERIAL, METHOD FOR PREPARING THE SAME, AND SECONDARY BATTERY AND ELECTRICAL DEVICE COMPRISING THE SAME CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED (CN) 2025-05-15 US disclosed
EP-4517870-A1 NEGATIVE ELECTRODE ACTIVE MATERIAL AND PREPARATION METHOD THEREFOR, AND SECONDARY BATTERY AND ELECTRICAL DEVICE CONTAINING NEGATIVE ELECTRODE ACTIVE MATERIAL Contemporary Amperex Technology (Hong Kong) Limited (HK) 2025-03-05 EP disclosed
WO-2025018802-A1 METHOD FOR FORMING THIN FILM USING TWO TYPES OF SILICON PRECURSOR COMPOUNDS 주식회사 한솔케미칼 2025-01-23 WO disclosed
EP-3561860-A1 METHOD OF FORMING A LOW-K LAYER AND METHOD OF FORMING A SEMICONDUCTOR DEVICE Samsung Electronics Co., Ltd. (KR) 2019-10-30 EP disclosed
WO-2019046301-A1 CONFORMAL HALOGEN DOPING IN 3D STRUCTURES USING CONFORMAL DOPANT FILM DEPOSITION APPLIED MATERIALS, INC. (US) 2019-03-07 WO disclosed
CN-107068537-A The method of material layer including its semiconductor devices and manufacture material layer and semiconductor devices 三星电子株式会社 2017-08-18 CN disclosed
US-20170133219-A1 MATERIAL LAYERS, SEMICONDUCTOR DEVICES INCLUDING THE SAME, AND METHODS OF FABRICATING MATERIAL LAYERS AND SEMICONDUCTOR DEVICES SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-05-11 US disclosed
JP-H06110197-A FORMATION OF MASK FORMING FINE PATTERN AND DEVICE THEREFOR HITACHI LTD 1994-04-22 JP disclosed
EP-0296702-A2 Method of forming semiconducting amorphous silicon films from the thermal decompositon of fluorohydridodisilanes DOW CORNING CORPORATION (US) 1988-12-28 EP disclosed
US-4762808-A Method of forming semiconducting amorphous silicon films from the thermal decomposition of fluorohydridodisilanes DOW CORNING CORPORATION (US) 1988-08-09 US disclosed