SCHEMBL93834

SCHEMBL93834

O=C(OC1CCCCCCCCC1)C(=CC1CCCCCCCCC1)C1CCCCCCCCC1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 2/20 0.39
CES2 O00748 1/20 0.37
CES1 P23141 1/20 0.37
LMNA P02545 1/20 0.36
MAPT P10636 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
NPSR1 Q6W5P4 1/20 0.36
CYP2C19 P33261 1/20 0.35
CA12 O43570 1/20 0.34
CA1 P00915 1/20 0.34
CA2 P00918 1/20 0.34
CA9 Q16790 1/20 0.34
NAAA Q02083 2/20 0.34
HTT P42858 1/20 0.33
GRIK1 P39086 1/20 0.33
HDAC8 Q9BY41 1/20 0.32
HDAC6 Q9UBN7 1/20 0.32
GPR35 Q9HC97 1/20 0.32
CYP19A1 P11511 1/20 0.32
ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9278599 1.00 EPHX1 (0.39) EPHX1CES2CES1LMNAMAPT
SCHEMBL9245846 0.98 EPHX1 (0.38) EPHX1CES2CES1LMNAMAPT
SCHEMBL14351569 0.98 EPHX1 (0.36) EPHX1CES2CES1LMNAMAPT
SCHEMBL29152273 0.83 EPHX1 (0.42) EPHX1CES2CES1LMNAMAPT
SCHEMBL2996958 0.83 EPHX1 (0.42) EPHX1CES2CES1LMNAMAPT
SCHEMBL21931861 0.81 EPHX1 (0.39) EPHX1CES2CES1LMNAMAPT
SCHEMBL5463375 0.81 EPHX1 (0.39) EPHX1CES2CES1LMNAMAPT
SCHEMBL28328154 0.80 ALDH1A1 (0.43) EPHX1LMNASMN1; SMN2NPSR1CYP2C19
SCHEMBL28436216 0.80 EPHX1 (0.38) EPHX1CES2CES1LMNAMAPT
SCHEMBL1832495 0.80 EPHX1 (0.38) EPHX1CES2CES1LMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1185 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117777165-B Photosensitive polyimide oligomer, preparation method and polyimide photosensitive resin composition prepared from photosensitive polyimide oligomer 信联聚科(上海)新材料有限公司 2026-05-15 CN claimed
CN-119798787-A Mesoporous material compound, preparation method thereof, photosensitive resin composition and preparation method thereof 上海信斯帝克新材料有限公司 2025-04-11 CN claimed
CN-117777165-A Photosensitive polyimide oligomer, preparation method and polyimide photosensitive resin composition prepared from photosensitive polyimide oligomer 上海信斯帝克新材料有限公司 2024-03-29 CN claimed
CN-109641998-B Polymerization-induced phase separation compositions based on acrylate networks 阿科玛法国公司 2022-04-15 CN claimed
CN-106459316-B Photocurable resin composition 株式会社东进世美肯 2020-03-17 CN claimed
US-9611402-B2 Hot melt compositions with improved etch resistance ROHM AND HAAS ELECTRONICS MATERIALS LLC (US) 2017-04-04 US claimed
CN-106459316-A Photocurable resin composition 株式会社东进世美肯 2017-02-22 CN claimed
EP-1544267-B1 PRIMER COMPOSITION FOR COATING MITSUBISHI RAYON CO (JP) 2014-08-13 EP claimed
US-7795348-B2 Acrylic or olefin substrates; excellent adhesion without chlorine compounds; acrylic copolymer with one of the monomers having a (meth)acryloyloxy group bonded to a pendant cyclohexyl, 4-t-butylcyclohexyl, isobornyl, tricyclodecanyl, 3,3,5-trimethylcyclohexyl, t-butyl or t-amyl group MITSUBISHI RAYON CO., LTD. (JP) 2010-09-14 US claimed
US-7105269-B2 Copolymer, polymer mixture, and radiation-sensitive resin composition JSR CORPORATION (JP) 2006-09-12 US claimed
US-5578417-A INK JET RECORDING HEADS FOR DISCHARGING ENERGY FROM GRAFT COPOLYMERS CANON KABUSHIKI KAISHA (JP) 1996-11-26 US claimed
EP-0307921-B1 RESIN COMPOSITION CURABLE WITH AN ACTIVE ENERGY RAY CONTAINING PHOTOPOLYMERIZABLE POLYURETHANE CANON KABUSHIKI KAISHA (JP) 1993-05-26 EP claimed
EP-0307919-B1 RESIN COMPOSITION CURABLE WITH AN ACTIVE ENERGY RAY CONTAINING EPOXY RESIN AND MONOMER WITH ETHYLENICALLY UNSATURATED BOND CANON KABUSHIKI KAISHA (JP) 1993-05-19 EP claimed
EP-0307923-B1 RESIN COMPOSITION CURABLE WITH AN ACTIVE ENERGY RAY CONTAINING HALF-ESTERIFICATED EPOXY RESIN AND MONOMER HAVING ETHYLENICALLY UNSATURATED BOND CANON KABUSHIKI KAISHA (JP) 1993-05-19 EP claimed
EP-0226387-B1 COATING RESIN COMPOSITION Hitachi Chemical Co., Ltd. (JP) 1992-03-04 EP claimed
EP-0156372-B1 PROCESS FOR PRODUCING PLASTIC INFORMATION-RECORDING MEDIUM AND RESIN COMPOSITION USED THEREFOR HITACHI, LTD. (JP) 1989-11-08 EP claimed
US-4812346-A MULTIFUNCTIONAL ACRYLATE, ACRYLATED CARBAMATE HITACHI LTD. (JP) 1989-03-14 US claimed
US-4795785-A CHLORINATED OLEFIN, UNSATURATED ORGANIC SILANE COMPOUND, (METH)ACRYLATE POLYMER HITACHI CHEMICAL COMPANY, LTD. (JP) 1989-01-03 US claimed
EP-0226387-A2 Coating resin composition Hitachi Chemical Co., Ltd. (JP) 1987-06-24 EP claimed
EP-0156372-A2 Process for producing plastic information-recording medium and resin composition used therefor HITACHI, LTD. (JP) 1985-10-02 EP claimed