⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3360248 | 0.82 | — | — | |
| SCHEMBL16496844 | 0.67 | — | — | |
| SCHEMBL16588569 | 0.65 | — | — | |
| SCHEMBL9158543 | 0.63 | — | — | |
| SCHEMBL6789438 | 0.63 | — | — | |
| SCHEMBL2400696 | 0.61 | — | — | |
| SCHEMBL14278960 | 0.60 | TSHR (0.31) | — | |
| SCHEMBL18063596 | 0.60 | — | — | |
| SCHEMBL727141 | 0.59 | — | — | |
| SCHEMBL13532427 | 0.59 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 159 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8173048-B2 | Composition for circuit connection film and circuit connection film using the same | CHEIL INDUSTRIES, INC. (KR) | 2012-05-08 | — | — | US | claimed |
| US-20100148130-A1 | Composition for circuit connection film and circuit connection film using the same | KUKDO ADVANCED MATERIALS CO., LTD. (KR) | 2010-06-17 | — | — | US | claimed |
| WO-2025109868-A1 | THERMOSETTING SILICONE COMPOSITION, DIE BONDING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE | 信越化学工業株式会社 | 2025-05-30 | — | — | WO | disclosed |
| WO-2025018368-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE | 株式会社レゾナック | 2025-01-23 | — | — | WO | disclosed |
| WO-2024150762-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| WO-2024150766-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| WO-2024150765-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| WO-2024150767-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| US-20240209182-A1 | HARDENER, ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE | RESONAC CORPORATION (JP) | 2024-06-27 | — | — | US | disclosed |
| WO-2023136286-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2023-07-20 | — | — | WO | disclosed |
| WO-2023136274-A1 | ADHESIVE AGENT COMPOSITION, ADHESIVE AGENT FILM FOR CIRCUIT CONNECTION, AND MANUFACTURING METHOD FOR CONNECTION STRUCTURE | 株式会社レゾナック | 2023-07-20 | — | — | WO | disclosed |
| US-20040214979-A1 | Polyurethanes and polyimides for wires or connectors and a process for connecting wires, curing with curing agents to form films. | FUJINAWA TOHRU | 2004-10-28 | — | — | US | disclosed |
| US-6777464-B1 | ELECTRONIC CIRCUIT-CONNECTING MATERIAL HAVING A SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-08-17 | — | — | US | disclosed |
| US-6762249-B1 | RAPID LOW TEMPERATURE SETTING; HIGH ADHESION, STRESS RELEAVING POLYURETHANE RESIN, FREE RADICAL POLYMERIZABLE MATERIAL AND CURING AGENT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-07-13 | — | — | US | disclosed |
| US-20030178138-A1 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-25 | — | — | US | disclosed |
| US-20030141014-A1 | Mixture of electroconductive particles and polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2003-07-31 | — | — | US | disclosed |
| US-20030027942-A1 | Resin composition , adhesive prepared therewith for bonding circuit members,and circuit boards | HITACHI CHEMICAL CO., LTD. (JP) | 2003-02-06 | — | — | US | disclosed |
| EP-1229095-A1 | ADHESIVE AGENT, METHOD FOR CONNECTING WIRING TERMINALS AND WIRING STRUCTURE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-08-07 | — | — | EP | disclosed |
| EP-1223795-A1 | WIRING-CONNECTING MATERIAL AND PROCESS FOR PRODUCING CIRCUIT BOARD WITH THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-07-17 | — | — | EP | disclosed |
| EP-0979854-A1 | CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-16 | — | — | EP | disclosed |