Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Caffeine. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ADORA2B known ✓ | P29275 | 10/20 | 0.96 |
| ▸ | ADORA2A known ✓ | P29274 | 2/20 | 0.96 |
| ▸ | ADORA3 known ✓ | P0DMS8 | 1/20 | 0.96 |
| ▸ | ADORA1 known ✓ | P30542 | 1/20 | 0.96 |
| ▸ | PIK3CD | O00329 | 1/20 | 0.96 |
| ▸ | POLB | P06746 | 1/20 | 0.96 |
| ▸ | CNR1 | P21554 | 1/20 | 0.96 |
| ▸ | ACHE | P22303 | 1/20 | 0.96 |
| ▸ | NTSR1 | P30989 | 1/20 | 0.96 |
| ▸ | MC3R | P41968 | 1/20 | 0.96 |
| ▸ | NOTUM | Q6P988 | 1/20 | 0.96 |
| ▸ | SIRT3 | Q9NTG7 | 1/20 | 0.96 |
| ▸ | GDA | Q9Y2T3 | 1/20 | 0.96 |
| ▸ | NR2E1 | Q9Y466 | 1/20 | 0.96 |
| ▸ | PDE4A | P27815 | 1/20 | 0.63 |
| ▸ | PDE4B | Q07343 | 1/20 | 0.63 |
| ▸ | PDE4C | Q08493 | 1/20 | 0.63 |
| ▸ | PDE4D | Q08499 | 1/20 | 0.63 |
| ▸ | MAPT | P10636 | 1/20 | 0.58 |
| ▸ | LMNA | P02545 | 1/20 | 0.58 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Caffeine SCHEMBL29590919 | 0.98 | ADORA2B (1.00) | ADORA2BADORA2APIK3CDPOLBADORA3 | |
| Caffeine SCHEMBL5671 | 0.98 | ADORA2B (1.00) | ADORA2BADORA2APIK3CDPOLBADORA3 | |
| Caffeine SCHEMBL29549294 | 0.98 | ADORA2B (1.00) | ADORA2BADORA2APIK3CDPOLBADORA3 | |
| Caffeine SCHEMBL8569482 | 0.98 | ADORA2B (1.00) | ADORA2BADORA2APIK3CDPOLBADORA3 | |
| Caffeine SCHEMBL901194 | 0.98 | ADORA2B (1.00) | ADORA2BADORA2APIK3CDPOLBADORA3 | |
| Caffeine SCHEMBL10478364 | 0.98 | ADORA2B (1.00) | ADORA2BADORA2APIK3CDPOLBADORA3 | |
| Caffeine SCHEMBL29549224 | 0.98 | ADORA2B (1.00) | ADORA2BADORA2APIK3CDPOLBADORA3 | |
| Caffeine SCHEMBL23004680 | 0.96 | ADORA2B (0.96) | ADORA2BADORA2APIK3CDPOLBADORA3 | |
| Caffeine SCHEMBL10407512 | 0.96 | ADORA2B (0.96) | ADORA2BADORA2APIK3CDPOLBADORA3 | |
| Caffeine SCHEMBL569367 | 0.96 | ADORA2B (0.96) | ADORA2BADORA2APIK3CDPOLBADORA3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20210193548-A1 | STIM/LIQUID METAL FILLED LASER DRILL TRENCH TO IMPROVE COOLING OF STACKED BOTTOM DIE | SK Hynix NAND Product Solutions Corp. (dba Solidigm) | 2021-06-24 | — | — | US | claimed |
| JP-6028104-A | — | — | None | — | — | JP | disclosed |
| US-20240030086-A1 | BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS | INTEL CORP (US) | 2024-01-25 | — | — | US | disclosed |
| US-11854931-B2 | STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die | INTEL CORPORATION (US) | 2023-12-26 | — | — | US | disclosed |
| US-11830783-B2 | Embedded substrate heat sink for bottom side cooling | INTEL CORPORATION (US) | 2023-11-28 | — | — | US | disclosed |
| US-11832419-B2 | Full package vapor chamber with IHS | INTEL CORPORATION (US) | 2023-11-28 | — | — | US | disclosed |
| US-11817364-B2 | BGA STIM package architecture for high performance systems | INTEL CORPORATION (US) | 2023-11-14 | — | — | US | disclosed |
| US-11670561-B2 | 3D buildup of thermally conductive layers to resolve die height differences | INTEL CORPORATION (US) | 2023-06-06 | — | — | US | disclosed |
| US-11664293-B2 | Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenarios | INTEL CORPORATION (US) | 2023-05-30 | — | — | US | disclosed |
| CN-114730746-A | Thermally conductive pillar/active die for improved cooling of stacked bottom die | 英特尔公司 | 2022-07-08 | — | — | CN | disclosed |
| US-20210193552-A1 | THERMALLY CONDUCTIVE SLUGS/ACTIVE DIES TO IMPROVE COOLING OF STACKED BOTTOM DIES | SK Hynix NAND Product Solutions Corp. (dba Solidigm) | 2021-06-24 | — | — | US | disclosed |
| US-20210195798-A1 | FULL PACKAGE VAPOR CHAMBER WITH IHS | INTEL CORPORATION | 2021-06-24 | — | — | US | disclosed |
| CN-113013115-A | 3D structure of heat conduction layer for solving tube core height difference | 英特尔公司 | 2021-06-22 | — | — | CN | disclosed |
| US-20210125897-A1 | SOLID STATE THERMOELECTRIC COOLER IN SILICON BACKEND LAYERS FOR FAST COOLING IN TURBO SCENARIOS | INTEL CORPORATION | 2021-04-29 | — | — | US | disclosed |
| US-20210118756-A1 | HYBRID INTERPOSER OF GLASS AND SILICON TO REDUCE THERMAL CROSSTALK | INTEL CORPORATION | 2021-04-22 | — | — | US | disclosed |
| US-20210111091-A1 | EMBEDDED SUBSTRATE HEAT SINK FOR BOTTOM SIDE COOLING | INTEL CORPORATION | 2021-04-15 | — | — | US | disclosed |
| US-20210104448-A1 | LATERAL HEAT REMOVAL FOR 3D STACK THERMAL MANAGEMENT | INTEL CORPORATION | 2021-04-08 | — | — | US | disclosed |
| US-20160197025-A1 | Method of Fabricating an Electronic Device | DOW CORNING CORPORATION | 2016-07-07 | — | — | US | disclosed |
| WO-2014099132-A1 | METHOD OF FABRICATING AN ELECTRONIC DEVICE | DOW CORNING CORPORATION (US) | 2014-06-26 | — | — | WO | disclosed |
| JP-H0628104-A | TRANSPARENT TOUCH PANEL | MATSUSHITA ELECTRIC IND CO LTD | 1994-02-04 | — | — | JP | disclosed |