SCHEMBL9398451

SCHEMBL9398451

CN(C)C=C1C=CC=CC1O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27342896 0.76
SCHEMBL4622145 0.73
SCHEMBL27967172 0.73
SCHEMBL27862781 0.72
SCHEMBL28414775 0.72
SCHEMBL1782950 0.71
SCHEMBL28165846 0.71 NFKB1 (0.33)
SCHEMBL28628089 0.71
SCHEMBL4587401 0.69
SCHEMBL27863776 0.69 PPARG (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118290688-A Polyurethane polymer containing oxazolidone structure and composite material thereof 万华化学(北京)有限公司 2024-07-05 CN claimed
US-20230212384-A1 HIGH-TEMPERATURE-RESISTANT INSULATING COATING MATERIAL AND PREPARATION METHOD THEREOF SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY CHINESE ACADEMY OF SCIENCES (CN) 2023-07-06 US claimed
CN-111171514-B Low dielectric composite material, preparation method and application thereof, and method for reducing dielectric constant of polymer 深圳先进技术研究院 2023-01-17 CN claimed
CN-112724867-B Insulating adhesive film material and preparation method and application thereof 深圳先进技术研究院 2023-01-10 CN claimed
CN-115537160-A Insulating adhesive film material for preparing fine circuit and preparation method thereof 深圳先进电子材料国际创新研究院 2022-12-30 CN claimed
CN-108250677-B Polymer-based composite material containing filler particle three-dimensional network and preparation method thereof 中国科学院深圳先进技术研究院 2022-10-14 CN claimed
CN-114603952-A Thickened insulating adhesive film and preparation method thereof 中国科学院深圳先进技术研究院 2022-06-10 CN claimed
CN-114479734-A Insulating adhesive film, preparation method and application thereof 深圳先进电子材料国际创新研究院 2022-05-13 CN claimed
CN-111087843-B High-dielectric-property insulating film material and preparation method thereof 中国科学院深圳先进技术研究院 2021-09-10 CN claimed
CN-112724867-A Insulating adhesive film material and preparation method and application thereof 深圳先进技术研究院 2021-04-30 CN claimed
CN-112662334-A Low-thermal expansion coefficient insulating adhesive film and preparation method thereof 中国科学院深圳先进技术研究院 2021-04-16 CN claimed
CN-111171514-A Low dielectric composite material, preparation method and application thereof, and method for reducing dielectric constant of polymer 深圳先进技术研究院 2020-05-19 CN claimed
CN-111087843-A High-dielectric-property insulating film material and preparation method thereof 中国科学院深圳先进技术研究院 2020-05-01 CN claimed
CN-118290688-A Polyurethane polymer containing oxazolidone structure and composite material thereof 万华化学(北京)有限公司 2024-07-05 CN disclosed
CN-111171514-B Low dielectric composite material, preparation method and application thereof, and method for reducing dielectric constant of polymer 深圳先进技术研究院 2023-01-17 CN disclosed
CN-112724867-B Insulating adhesive film material and preparation method and application thereof 深圳先进技术研究院 2023-01-10 CN disclosed
CN-102093593-A Resin-based composite material additive type flame retardant, flame-retarding composite material and preparation methods thereof NAT UNIV DEFENSE TECHNOLOGY 2011-06-15 CN disclosed
CN-100365063-C Filtering layer resin materials and method for preparing same DIANJIE LU (CN) 2008-01-30 CN disclosed
CN-1827683-A Filtering layer resin materials and method for preparing same LU DIANJIE (CN) 2006-09-06 CN disclosed
US-5321062-A Enhances ability of hardenable polyepoxide resin to coat and bond to material HALLIBURTON COMPANY (US) 1994-06-14 US disclosed