SCHEMBL94048

SCHEMBL94048

C=CC(C)(C)[Si](C)(C)C=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9862824 0.73
SCHEMBL1493141 0.73
SCHEMBL15195580 0.69
SCHEMBL15065771 0.67
SCHEMBL12228116 0.66
SCHEMBL17254415 0.65 TSHR (0.30)
SCHEMBL15840107 0.65 TSHR (0.30)
SCHEMBL31351442 0.65
SCHEMBL2387068 0.65
Ethylene Glycol SCHEMBL2076290 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9657175-B2 Silicone resin composition for sealing optical semiconductor element and optical semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-23 US disclosed
US-20160108240-A1 SILICONE RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-04-21 US disclosed
US-8933158-B2 Thermosetting silicone resin composition for reflector of LED, reflector for LED using the same and optical semiconductor apparatus SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-01-13 US disclosed
US-20140175488-A1 HEAT-CURABLE SILICONE RESIN SHEET HAVING PHOSPHOR-CONTAINING LAYER AND WHITE PIGMENT-CONTAINING LAYER, METHOD OF PRODUCING LIGHT EMITTING DEVICE USING SAME AND ENCAPSULATED LIGHT EMITTING SEMICONDUCTOR DEVICE PRODUCED THEREBY SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-06-26 US disclosed
US-8569429-B2 Curable silicone resin composition with high reliability and optical semiconductor device using same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-10-29 US disclosed
US-20130274398-A1 THERMOSETTING SILICONE RESIN COMPOSITION FOR REFLECTOR OF LED, REFLECTOR FOR LED USING THE SAME AND OPTICAL SEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-10-17 US disclosed
US-8481656-B2 Silicone resin composition and optical semiconductor device using the composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-07-09 US disclosed
US-20130161683-A1 CURABLE SILICONE RESIN COMPOSITION WITH HIGH RELIABILITY AND OPTICAL SEMICONDUCTOR DEVICE USING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-06-27 US disclosed
US-8420762-B2 Silicone resin composition and a cured product thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-04-16 US disclosed
US-20120256325-A1 SILICONE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE USING THE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-10-11 US disclosed
US-20120056236-A1 LOW GAS PERMEABLE SILICONE RESIN COMPOSITION AND OPTOELECTRONIC DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-03-08 US disclosed
US-8057906-B2 Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-11-15 US disclosed
US-20110269918-A1 HIGH ADHESIVENESS SILICONE RESIN COMPOSITION AND AN OPTICAL SEMICONDUCTOR DEVICE PROVIDED WITH A CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-11-03 US disclosed
US-20110147955-A1 SILICONE RESIN COMPOSITION AND A CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-06-23 US disclosed
US-7829651-B2 Lens-forming silicone resin composition and silicone lens SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-11-09 US disclosed
US-20100103507-A1 VISIBLE LIGHT-SHIELDING SILICONE RUBBER COMPOSITION, CURED PRODUCT, AND OPTOELECTRONIC DEVICE SHIN-ETSU CHEMICAL CO., LTD (JP) 2010-04-29 US disclosed
US-7588967-B2 Curable silicone rubber composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-09-15 US disclosed
US-20070077360-A1 Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device SHIN -ETSU CHEMICAL CO., LTD. (JP) 2007-04-05 US disclosed