Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PTGS1 | P23219 | 1/20 | 0.37 |
| ▸ | AKR1C3 | P42330 | 1/20 | 0.37 |
| ▸ | FFAR3 | O14843 | 2/20 | 0.35 |
| ▸ | LCK | P06239 | 1/20 | 0.35 |
| ▸ | FYN | P06241 | 1/20 | 0.35 |
| ▸ | MAPT | P10636 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20586201 | 1.00 | PTGS1 (0.37) | PTGS1AKR1C3FFAR3LCKFYN | |
| Cyclohexane SCHEMBL220149 | 1.00 | PTGS1 (0.37) | PTGS1AKR1C3FFAR3LCKFYN | |
| SCHEMBL28626882 | 1.00 | PTGS1 (0.37) | PTGS1AKR1C3FFAR3LCKFYN | |
| SCHEMBL871351 | 0.90 | FFAR3 (0.43) | PTGS1AKR1C3FFAR3LCKFYN | |
| SCHEMBL18814 | 0.90 | — | — | |
| SCHEMBL15042 | 0.90 | — | — | |
| SCHEMBL338643 | 0.90 | FFAR3 (0.43) | PTGS1AKR1C3FFAR3LCKFYN | |
| SCHEMBL133954 | 0.90 | — | — | |
| SCHEMBL1396002 | 0.90 | FFAR3 (0.43) | PTGS1AKR1C3FFAR3LCKFYN | |
| SCHEMBL8163204 | 0.90 | FFAR3 (0.43) | PTGS1AKR1C3FFAR3LCKFYN |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 251 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116904146-A | High-insulation-resistance thermosetting adhesive and preparation method thereof | 佳信新材料(惠州)有限公司 | 2023-10-20 | — | — | CN | claimed |
| WO-2022166600-A1 | PHOTOCURING MICROFLUIDIC CHIP BASED ON ELASTIC SUPPORT BODY, AND MANUFACTURING METHOD AND APPLICATION OF PHOTOCURING MICROFLUIDIC CHIP | 浙江大学 | 2022-08-11 | — | — | WO | claimed |
| CN-112892627-B | Photocuring micro-fluidic chip based on elastic support body and preparation method and application thereof | 浙江大学 | 2022-04-05 | — | — | CN | claimed |
| CN-112892627-A | Photocuring micro-fluidic chip based on elastic support body and preparation method and application thereof | 浙江大学 | 2021-06-04 | — | — | CN | claimed |
| US-9543584-B2 | Binder for secondary battery providing excellent cycle property | LG CHEM, LTD. (KR) | 2017-01-10 | — | — | US | claimed |
| US-20130202963-A1 | Binder For Secondary Battery Providing Excellent Cycle Property | LG CHEM, LTD. (KR) | 2013-08-08 | — | — | US | claimed |
| EP-2583338-A2 | BINDER FOR SECONDARY BATTERY PROVIDING EXCELLENT CYCLE PROPERTY | LG Chem, Ltd. (KR) | 2013-04-24 | — | — | EP | claimed |
| US-8148442-B2 | Pressure sensitive adhesive for polarizing plates, polarizing plate with pressure sensitive adhesive and production process for polarizing plate | LINTEC CORPORATION (JP) | 2012-04-03 | — | — | US | claimed |
| WO-2011159057-A2 | BINDER FOR SECONDARY BATTERY PROVIDING EXCELLENT CYCLE PROPERTY | LG CHEM, LTD. (KR) | 2011-12-22 | — | — | WO | claimed |
| US-6166158-A | High index/high abbe number composition | SOLA INTERNATIONAL HOLDINGS LTD. (AU) | 2000-12-26 | — | — | US | claimed |
| US-5977276-A | High index/high Abbe number composition | SOLA INTERNATIONAL HOLDINGS LTD. (AU) | 1999-11-02 | — | — | US | claimed |
| EP-0828766-A4 | — | — | 1998-04-22 | — | — | EP | claimed |
| EP-0828766-A1 | HIGH INDEX/HIGH ABBE NUMBER COMPOSITION | SOLA INTERNATIONAL HOLDINGS, LTD. (AU) | 1998-03-18 | — | — | EP | claimed |
| WO-1996038486-A1 | HIGH INDEX/HIGH ABBE NUMBER COMPOSITION | SOLA INTERNATIONAL HOLDINGS LTD. (AU) | 1996-12-05 | — | — | WO | claimed |
| WO-2026105568-A1 | SEMICONDUCTOR PROCESSING SHEET | 日東電工株式会社 | 2026-05-21 | — | — | WO | disclosed |
| CN-120081984-A | Photosensitive resin composition and use method and application thereof | 杭州先临齿科技术有限公司 | 2025-06-03 | — | — | CN | disclosed |
| US-12321056-B2 | Resin composition and display unit | DEXERIALS CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| EP-1107267-A1 | ELECTROLYTE COMPOSITION FOR ELECTRIC DOUBLE LAYER CAPACITOR, SOLID POLYMER ELECTROLYTE, COMPOSITION FOR POLARIZABLE ELECTRODE, POLARIZABLE ELECTRODE, AND ELECTRIC DOUBLE LAYER CAPACITOR | NISSHINBO INDUSTRIES, INC. (JP) | 2001-06-13 | — | — | EP | disclosed |
| EP-1090956-A1 | COMPOSITION FOR IONICALLY CONDUCTIVE SOLID POLYMER, IONICALLY CONDUCTIVE SOLID POLYELECTROLYTE, BINDER RESIN, AND SECONDARY BATTERY | NISSHINBO INDUSTRIES, INC. (JP) | 2001-04-11 | — | — | EP | disclosed |
| EP-1057869-A1 | COMPOSITION FOR IONICALLY CONDUCTIVE POLYELECTROLYTE AND IONICALLY CONDUCTIVE SOLID POLYELECTROLYTE | NISSHINBO INDUSTRIES, INC. (JP) | 2000-12-06 | — | — | EP | disclosed |