SCHEMBL9419003

SCHEMBL9419003

CCCCCCCCCCCCNC(=O)CCC(=O)NCCCCCCCCCCCC

nearest known ligand 0.87

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
CASP2 P42575 1/20 0.87
NAAA Q02083 1/20 0.80
FAAH O00519 5/20 0.68
EPHX1 P07099 6/20 0.67
DNM1 Q05193 2/20 0.63
EPHX2 P34913 2/20 0.61

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13700211 1.00 CASP2 (0.87) CASP2NAAAFAAHEPHX1DNM1
SCHEMBL13700142 1.00 CASP2 (0.87) CASP2NAAAFAAHEPHX1DNM1
SCHEMBL8699687 1.00 CASP2 (0.87) CASP2NAAAFAAHEPHX1DNM1
SCHEMBL22211254 1.00 CASP2 (0.87) CASP2NAAAFAAHEPHX1DNM1
SCHEMBL7887680 1.00 CASP2 (0.87) CASP2NAAAFAAHEPHX1DNM1
SCHEMBL11050057 1.00 CASP2 (0.87) CASP2NAAAFAAHEPHX1DNM1
SCHEMBL7643570 1.00 CASP2 (0.87) CASP2NAAAFAAHEPHX1DNM1
Dimethylamine SCHEMBL28536584 0.96 CASP2 (0.80) CASP2NAAAFAAHEPHX1DNM1
SCHEMBL23775006 0.93 CASP2 (0.83) CASP2NAAAFAAHEPHX1DNM1
SCHEMBL21633848 0.93 CASP2 (0.83) CASP2NAAAFAAHEPHX1DNM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7585813-B2 Reversible thermosensitive recording medium, label and member, and image processing apparatus and method RICOH COMPANY, LTD. (JP) 2009-09-08 US disclosed
US-20070225163-A1 Reversible thermosensitive recording medium, label and member, and image processing apparatus and method SHIMBO HITOSHI 2007-09-27 US disclosed
EP-0382548-B1 Thermoplastic resin composition SUMITOMO CHEMICAL CO (JP) 1994-06-29 EP disclosed
US-5116906-A Molding materials SUMITOMO CHEMICAL CO., LTD. (JP) 1992-05-26 US disclosed
EP-0382548-A2 Thermoplastic resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1990-08-16 EP disclosed
US-3997698-A Process of sizing fabrics and threads with triamides LEVER BROTHERS COMPANY (US) 1976-12-14 US disclosed