SCHEMBL942869

SCHEMBL942869

C=CCOC(=O)C1CCC2OC2C1

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 1/20 0.37
PPM1B O75688 3/20 0.35
PTPN1 P18031 3/20 0.35
PPP1CC P36873 3/20 0.35
ALDH1A1 P00352 1/20 0.33
GAA P10253 1/20 0.33
CYP3A4 P08684 1/20 0.32
TSHR P16473 3/20 0.31
POLB P06746 1/20 0.31
MAPK1 P28482 1/20 0.31
KDM4E B2RXH2 1/20 0.31
GMNN O75496 1/20 0.31
LMNA P02545 1/20 0.31
PMP22 Q01453 1/20 0.31
TFPI2 P48307 1/20 0.31
TP53 P04637 1/20 0.31
NFKB1 P19838 1/20 0.31
THPO P40225 1/20 0.31
MAPT P10636 1/20 0.30
CACNA1B Q00975 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3785892 0.91 CYP3A4 (0.34) KMT2APPM1BPTPN1PPP1CCALDH1A1
SCHEMBL3794014 0.90 ALDH1A1 (0.34) KMT2APPM1BPTPN1PPP1CCALDH1A1
SCHEMBL11704083 0.88 PPM1B (0.36) PPM1BPTPN1PPP1CCTSHRKDM4E
SCHEMBL11704074 0.88 PPM1B (0.36) PPM1BPTPN1PPP1CCTSHRKDM4E
SCHEMBL1060953 0.82 TSHR (0.39) PPM1BPTPN1PPP1CCALDH1A1GAA
SCHEMBL259158 0.82 PPM1B (0.44) PPM1BPTPN1PPP1CCALDH1A1TSHR
SCHEMBL11933900 0.82 PPM1B (0.39) PPM1BPTPN1PPP1CCTSHRKDM4E
SCHEMBL423892 0.82 KMT2A (0.47) KMT2AALDH1A1GAACYP3A4TSHR
SCHEMBL719931 0.82
SCHEMBL14415201 0.81 TSHR (0.43) KMT2APPM1BPTPN1PPP1CCALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 100 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117887038-A Cationic-curable aqueous epoxy resin, preparation method thereof, aqueous 3D printing resin prepared from cationic-curable aqueous epoxy resin and preparation method of aqueous 3D printing resin 上海信斯帝克新材料有限公司 2024-04-16 CN claimed
US-9546337-B2 Lubricant composition JX NIPPON OIL & ENERGY CORPORATION (JP) 2017-01-17 US claimed
EP-2578612-B1 FLUORINE- AND EPOXY GROUP-CONTAINING COPOLYMER, AND METHOD FOR PRODUCING SAME SHOWA DENKO KK (JP) 2016-07-20 EP claimed
US-20150252281-A1 LUBRICANT COMPOSITION JX NIPPON OIL & ENERGY CORPORATION (JP) 2015-09-10 US claimed
CN-102892806-B Fluorine-and epoxy-containing copolymer and method for producing same SHOWA DENKO KABUSHIKI KAISHA (JP) 2015-09-02 CN claimed
EP-2891703-A1 LUBRICANT COMPOSITION JX Nippon Oil & Energy Corporation (JP) 2015-07-08 EP claimed
EP-2314634-B1 EPOXY-GROUP-CONTAINING COPOLYMER, EPOXY (METH)ACRYLATE COPOLYMER USING SAME, AND PROCESSES FOR PRODUCING THE COPOLYMERS SHOWA DENKO KK (JP) 2014-05-07 EP claimed
US-8541508-B2 Epoxy group-containing copolymer, epoxy (meth)acrylate copolymer using the same and their production processes SHOWA DENKO K.K. (JP) 2013-09-24 US claimed
EP-2578612-A1 FLUORINE- AND EPOXY GROUP-CONTAINING COPOLYMER, AND METHOD FOR PRODUCING SAME Showa Denko K.K. (JP) 2013-04-10 EP claimed
US-20130035461-A1 FLUORINE AND EPOXY GROUP-CONTAINING COPOLYMER, AND METHOD FOR PRODUCING SAME SHOWA DENKO K.K. (JP) 2013-02-07 US claimed
CN-102892806-A Fluorine-and epoxy-containing copolymer and method for producing same SHOWA DENKO KK 2013-01-23 CN claimed
CN-102112505-A Epoxy-group-containing copolymer, epoxy (methyl) acrylate copolymer using same, and processes for producing copolymers SHOWA DENKO KK 2011-06-29 CN claimed
US-20110144279-A1 EPOXY GROUP-CONTAINING COPOLYMER, EPOXY (METH)ACRYLATE COPOLYMER USING THE SAME AND THEIR PRODUCTION PROCESSES SHOWA DENKO K.K. (JP) 2011-06-16 US claimed
EP-2314634-A1 EPOXY-GROUP-CONTAINING COPOLYMER, EPOXY (METH)ACRYLATE COPOLYMER USING SAME, AND PROCESSES FOR PRODUCING THE COPOLYMERS Showa Denko K.K. (JP) 2011-04-27 EP claimed
US-20250210403-A1 PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2025-06-26 US disclosed
US-12264073-B2 Composite material ADEKA CORPORATION (JP) 2025-04-01 US disclosed
CN-114829505-B Molded body, precursor thereof, method for producing same, and use thereof 株式会社大赛璐 2024-05-03 CN disclosed
EP-1682599-A1 TOUGHER CYCLOALIPHATIC EPOXIDE RESINS UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 2006-07-26 EP disclosed
WO-2005044890-A1 TOUGHER CYCLOALIPHATIC EPOXIDE RESINS UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 2005-05-19 WO disclosed
US-6201070-B1 PROTECTIVE COATINGS WITH CYCLOHEXYLEPOXIDECARBOXYLIC ESTERS UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION 2001-03-13 US disclosed