SCHEMBL94497

SCHEMBL94497

CCCCC(CC)C(=O)OOOC(C)(C)CCC

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 P00918 7/20 0.53
CA1 P00915 4/20 0.53
MAPK1 P28482 2/20 0.44
ATM Q13315 2/20 0.39
GAA P10253 1/20 0.39
XBP1 P17861 1/20 0.39
NPSR1 Q6W5P4 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
TSHR P16473 3/20 0.34
CYP3A4 P08684 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
USP2 O75604 1/20 0.33
SLC1A3 P43003 1/20 0.33
SLC1A2 P43004 1/20 0.33
SLC1A1 P43005 1/20 0.33
MEN1 O00255 1/20 0.31
ALDH1A1 P00352 1/20 0.31
MAPT P10636 1/20 0.31
KMT2A Q03164 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10343162 0.92 CA2 (0.51) CA2CA1MAPK1ATMGAA
SCHEMBL12140593 0.90 CA2 (0.56) CA2CA1MAPK1ATMGAA
SCHEMBL8509552 0.90 CA2 (0.38) CA2CA1MAPK1
SCHEMBL24902 0.89 CA2 (0.54) CA2CA1MAPK1ATMGAA
SCHEMBL49381 0.86 CA2 (0.51) CA2CA1MAPK1ATMGAA
SCHEMBL57471 0.85 CA2 (0.58) CA2CA1MAPK1ATMGAA
SCHEMBL37317 0.85 CA2 (0.58) CA2CA1MAPK1ATMGAA
SCHEMBL23036028 0.85 CA2 (0.50) CA2CA1MAPK1ATMGAA
SCHEMBL10714547 0.84 CA2 (0.56) CA2CA1MAPK1ATMGAA
Hydrogen Peroxide SCHEMBL15855960 0.84 CA2 (0.56) CA2CA1MAPK1ATMGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2088 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250304756-A1 COMPOSITION, FILM, DISPLAY PANEL AND DISPLAY DEVICE SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. (CN) 2025-10-02 US claimed
WO-2024090151-A1 RADICALLY POLYMERIZABLE RESIN COMPOSITION AND PIPE REHABILITATION LINER MATERIAL 株式会社レゾナック 2024-05-02 WO claimed
WO-2023140096-A1 MODIFIED ALIPHATIC POLYESTER-BASED RESIN AND COMPOSITION OR MOLDED BODY THEREOF 株式会社カネカ 2023-07-27 WO claimed
WO-2023140097-A1 METHOD FOR MANUFACTURING MODIFIED ALIPHATIC OR ALIPHATIC AROMATIC THERMOPLASTIC POLYESTER RESIN 株式会社カネカ 2023-07-27 WO claimed
CN-110914354-B Fluorinated elastomers cured by actinic radiation and methods thereof 3M创新有限公司 2022-07-19 CN claimed
EP-4004061-A1 AQUEOUS ORGANIC PEROXIDE EMULSION ARKEMA FRANCE (FR) 2022-06-01 EP claimed
US-20210403701-A1 CURABLE RESIN COMPOSITION, AND FILM, MOLDED ARTICLE, PREPREG, AND FIBER-REINFORCED PLASTIC USING SAID CURABLE RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2021-12-30 US claimed
US-11008456-B2 Resin composition and uses of the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2021-05-18 US claimed
US-20200291228-A1 RESIN COMPOSITION AND USES OF THE SAME TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2020-09-17 US claimed
EP-3282290-B1 COMPOSITION FOR THE MANUFACTURE OF AN OPHTALMIC LENS COMPRISING AN ENCAPSULATED LIGHT-ABSORBING ADDITIVE ESSILOR INT (FR) 2018-10-17 EP claimed
US-20140332712-A1 UNSATURATED POLYESTER RESIN COMPOSITION AND ENCAPSULATED MOTOR RESONAC CORPORATION (JP) 2014-11-13 US claimed
EP-2787015-A1 UNSATURATED POLYESTER RESIN COMPOSITION AND ENCAPSULATED MOTOR Showa Denko K.K. (JP) 2014-10-08 EP claimed
EP-2447293-B1 UNSATURATED POLYESTER RESIN COMPOSITION AND ENCAPSULATED MOTOR SHOWA DENKO KK (JP) 2014-06-04 EP claimed
US-8729321-B2 Fluoroalkyl iodide and its production process ASAHI GLASS COMPANY, LIMITED (JP) 2014-05-20 US claimed
US-20130296493-A1 MODIFIED NATURAL RUBBER AND METHOD OF MANUFACTURING THE SAME, RUBBER COMPOSITION AND TIRE BRIDGESTONE CORPORATION (JP) 2013-11-07 US claimed
US-8173048-B2 Composition for circuit connection film and circuit connection film using the same CHEIL INDUSTRIES, INC. (KR) 2012-05-08 US claimed
US-20100148130-A1 Composition for circuit connection film and circuit connection film using the same KUKDO ADVANCED MATERIALS CO., LTD. (KR) 2010-06-17 US claimed
EP-1197502-B1 Waterborne resin emulsion and waterborne coating DAINIPPON INK & CHEMICALS (JP) 2005-09-28 EP claimed
US-6051617-A POLYPROPYLENE RESIN GRAFT POLYMERIZED TO VINYL COMONOMER JSP CORPORATION (JP) 2000-04-18 US claimed
EP-0823443-A2 Foamed particles of modified polypropylene resin and method of preparing same JSP CORPORATION (JP) 1998-02-11 EP claimed