SCHEMBL9470239

SCHEMBL9470239

O=C(OC1CCCCC1)C1=COC1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MMP9 P14780 3/20 0.44
MMP12 P39900 3/20 0.44
MMP1 P03956 2/20 0.44
MMP2 P08253 2/20 0.43
STS P08842 4/20 0.42
SMN1; SMN2 Q16637 4/20 0.42
LMNA P02545 2/20 0.42
MAPT P10636 2/20 0.42
NPSR1 Q6W5P4 1/20 0.42
NPC1 O15118 3/20 0.41
RAB9A P51151 3/20 0.41
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
HTT P42858 2/20 0.40
EPHX1 P07099 2/20 0.39
TSHR P16473 1/20 0.39
CYP19A1 P11511 1/20 0.38
SLC6A3 Q01959 1/20 0.38
SERPINE1 P05121 1/20 0.37
ALDH1A1 P00352 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6939649 0.77 MMP9 (0.46) MMP9MMP12MMP1MMP2STS
SCHEMBL8827283 0.75 MMP9 (0.44) MMP9MMP12MMP1MMP2STS
SCHEMBL828645 0.74 NPC1 (0.54) MMP9MMP12MMP1MMP2STS
SCHEMBL28078408 0.73 HDAC2 (0.46) MMP9MMP12MMP1MMP2STS
SCHEMBL110657 0.72 SMN1; SMN2 (0.68) MMP9MMP12MMP1MMP2STS
SCHEMBL6577408 0.72 SERPINE1 (0.60) MMP9MMP12MMP1MMP2STS
SCHEMBL28476348 0.72 NPC1 (0.49) MMP9MMP12MMP1MMP2STS
SCHEMBL8685407 0.71 MMP9 (0.47) MMP9MMP12MMP1MMP2STS
SCHEMBL27647410 0.71 SMN1; SMN2 (0.66) MMP9MMP12MMP1MMP2STS
SCHEMBL27647433 0.71 SMN1; SMN2 (0.66) MMP9MMP12MMP1MMP2STS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115521625-B Low-temperature bonding boiling-resistant double-component addition type silicone rubber and preparation method thereof 硅宝(深圳)研发中心有限公司 2023-09-08 CN claimed
CN-115521625-A Low-temperature bonding boiling-resistant bi-component addition type silicone rubber and preparation method thereof 硅宝(深圳)研发中心有限公司 2022-12-27 CN claimed
CN-115521625-B Low-temperature bonding boiling-resistant double-component addition type silicone rubber and preparation method thereof 硅宝(深圳)研发中心有限公司 2023-09-08 CN disclosed
CN-112778953-B High-peel strength epoxy modified two-component methacrylate adhesive 道生天合材料科技(上海)股份有限公司 2023-05-05 CN disclosed
CN-110997749-B Epoxy resin composition and cured product 综研化学株式会社 2023-01-03 CN disclosed
CN-115521625-A Low-temperature bonding boiling-resistant bi-component addition type silicone rubber and preparation method thereof 硅宝(深圳)研发中心有限公司 2022-12-27 CN disclosed
CN-112778953-A High-peel-strength epoxy modified double-component methacrylate adhesive 道生天合材料科技(上海)股份有限公司 2021-05-11 CN disclosed
CN-110997749-A Epoxy resin composition and cured product 综研化学株式会社 2020-04-10 CN disclosed
US-5206295-A Coating composition comprising an anhydride-containing polymer and a structured epoxy-containing polymer E. I. DU PONT DE NEMOURS AND COMPANY (US) 1993-04-27 US disclosed