Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 2/20 | 0.40 |
| ▸ | OXTR | P30559 | 1/20 | 0.38 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.38 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.38 |
| ▸ | APP | P05067 | 1/20 | 0.36 |
| ▸ | MAOA | P21397 | 1/20 | 0.35 |
| ▸ | MAOB | P27338 | 1/20 | 0.35 |
| ▸ | ADRA1D | P25100 | 1/20 | 0.35 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.35 |
| ▸ | ADRA1B | P35368 | 1/20 | 0.35 |
| ▸ | PKM | P14618 | 1/20 | 0.35 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.35 |
| ▸ | ABCG2 | Q9UNQ0 | 1/20 | 0.34 |
| ▸ | ITGB2 | P05107 | 1/20 | 0.34 |
| ▸ | ICAM1 | P05362 | 1/20 | 0.34 |
| ▸ | ITGAL | P20701 | 1/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.34 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.34 |
| ▸ | MEN1 | O00255 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13224414 | 0.88 | CYP1A2 (0.40) | CYP1A2OXTRCYP2D6CYP3A4HIF1A | |
| SCHEMBL29356128 | 0.88 | CYP1A2 (0.40) | CYP1A2OXTRCYP2D6CYP3A4HIF1A | |
| SCHEMBL22383749 | 0.86 | CYP1A2 (0.35) | CYP1A2CYP2D6CYP3A4HIF1AAPP | |
| SCHEMBL8034574 | 0.85 | CYP1A2 (0.40) | CYP1A2OXTRCYP2D6CYP3A4HIF1A | |
| SCHEMBL21865868 | 0.83 | CYP1A2 (0.55) | CYP1A2CYP2D6CYP3A4HIF1ASIGMAR1 | |
| SCHEMBL19832093 | 0.82 | CYP1A2 (0.35) | CYP1A2OXTRCYP2D6CYP3A4HIF1A | |
| SCHEMBL24419882 | 0.82 | CYP1A2 (0.45) | CYP1A2CYP2D6CYP3A4HIF1AAPP | |
| SCHEMBL111021 | 0.82 | APP (0.41) | CYP1A2OXTRCYP2D6CYP3A4HIF1A | |
| SCHEMBL28677044 | 0.82 | CYP1A2 (0.62) | CYP1A2CYP2D6CYP3A4HIF1ASIGMAR1 | |
| SCHEMBL862833 | 0.80 | ADRA1D (0.57) | CYP1A2OXTRCYP2D6CYP3A4HIF1A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4289882-A1 | COMPOSITION FOR CURABLE RESINS, CURED PRODUCT OF SAID COMPOSITION, METHOD FOR PRODUCING SAID COMPOSITION, METHOD FOR PRODUCING SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE | ENEOS Corporation (JP) | 2023-12-13 | — | — | EP | disclosed |
| EP-3553129-B1 | CURING RESIN COMPOSITION, CURED PRODUCT OF, AND CURING METHOD FOR, CURING RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | ENEOS CORP (JP) | 2023-11-22 | — | — | EP | disclosed |
| US-11780772-B2 | Glass-resin composite-based multi-composite material | COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN (FR) | 2023-10-10 | — | — | US | disclosed |
| EP-3702391-A1 | COMPOSITION FOR CURABLE RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE | JXTG Nippon Oil & Energy Corporation (JP) | 2020-09-02 | — | — | EP | disclosed |
| EP-3702390-A1 | COMPOSITION FOR CURED RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE | JXTG Nippon Oil & Energy Corporation (JP) | 2020-09-02 | — | — | EP | disclosed |
| EP-3702388-A1 | COMPOSITION FOR CURED RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE | JXTG Nippon Oil & Energy Corporation (JP) | 2020-09-02 | — | — | EP | disclosed |
| WO-2020027257-A1 | COMPOSITION FOR CURED RESINS, CURED PRODUCT OF SAID COMPOSITION, METHOD FOR PRODUCING SAID COMPOSITION, METHOD FOR PRODUCING SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE | ＪＸＴＧエネルギー株式会社 | 2020-02-06 | — | — | WO | disclosed |
| US-9611360-B2 | Curable composition, article, method of curing, and tack-free reaction product | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2017-04-04 | — | — | US | disclosed |
| US-8846790-B2 | Resin composition, and prepreg and printed circuit board prepared using the same | TAIWAN UNION TECHNOLOGY CORPORATION (TW) | 2014-09-30 | — | — | US | disclosed |
| US-8580916-B2 | Stable solution of the polymer prepared from N,O-heterocycles and its preparation method and use | TAIWAN UNION TECHNOLOGY CORPORATION (TW) | 2013-11-12 | — | — | US | disclosed |
| US-20120279769-A1 | RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME | TAIWAN UNION TECHNOLOGY CORPORATION (TW) | 2012-11-08 | — | — | US | disclosed |
| US-20120097437-A1 | Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same | TAIWAN UNION TECHNOLOGY CORPORATION (TW) | 2012-04-26 | — | — | US | disclosed |
| US-20120059096-A1 | Stable Solution of the Polymer Prepared from N,O-Heterocycles and its Preparation Method and Use | TAIWAN UNION TECHNOLOGY CORPORATION (TW) | 2012-03-08 | — | — | US | disclosed |