Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 16/20 | 0.64 |
| ▸ | FAAH | O00519 | 5/20 | 0.52 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.49 |
| ▸ | PKM | P14618 | 2/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.49 |
| ▸ | HPGD | P15428 | 2/20 | 0.49 |
| ▸ | HTT | P42858 | 2/20 | 0.49 |
| ▸ | MEN1 | O00255 | 1/20 | 0.49 |
| ▸ | LMNA | P02545 | 1/20 | 0.49 |
| ▸ | CCR6 | P51684 | 1/20 | 0.49 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.49 |
| ▸ | ATM | Q13315 | 1/20 | 0.49 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.41 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.41 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.41 |
| ▸ | BCHE | P06276 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15875894 | 1.00 | MGLL (0.64) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL485546 | 1.00 | MGLL (0.64) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL24541383 | 0.94 | MGLL (0.70) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL24753819 | 0.94 | MGLL (0.61) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL18859867 | 0.91 | MGLL (0.54) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL26452127 | 0.91 | MGLL (0.54) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL487831 | 0.91 | MGLL (0.58) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL8766700 | 0.90 | MGLL (0.53) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL27043298 | 0.90 | MGLL (0.53) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL26764130 | 0.90 | MGLL (0.53) | MGLLFAAHHSP90AA1PKMALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2340 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4724044-A2 | TREATMENT OF AMYOTROPHIC LATERAL SCLEROSIS WITH EXTRACELLULAR VESICLE COMPOSITION | Direct Biologics, LLC (US) | 2026-04-15 | — | — | EP | claimed |
| US-12568848-B2 | Film, laminate, semiconductor wafer with film layer, substrate for mounting a semiconductor with film layer, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-03-03 | — | — | US | claimed |
| US-20250254792-A1 | RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-08-07 | — | — | US | claimed |
| US-20250206919-A1 | RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-06-26 | — | — | US | claimed |
| US-20250206915-A1 | RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-06-26 | — | — | US | claimed |
| WO-2025123873-A1 | MODIFIED BISMALEIMIDE PREPOLYMER, PREPARATION METHOD THEREFOR AND USE THEREOF, AND RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND USE THEREOF | 广东盈骅新材料科技有限公司 | 2025-06-19 | — | — | WO | claimed |
| WO-2025123875-A1 | RESIN COMPOSITION, PREPREG AND PREPARATION METHOD THEREFOR, AND LAMINATE AND PREPARATION METHOD THEREFOR | 广东盈骅新材料科技有限公司 | 2025-06-19 | — | — | WO | claimed |
| EP-3992231-B1 | USE OF A FILM IN A PRE-APPLIED UNDERFILL MATERIAL | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-05-28 | — | — | EP | claimed |
| CN-120003105-A | Method for producing dry fiber material, dry fiber material and application | 中国航空制造技术研究院 | 2025-05-16 | — | — | CN | claimed |
| EP-3786233-B1 | RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-04-23 | — | — | EP | claimed |
| US-20020177638-A1 | Insulated electric power cable | THE FURUKAWA ELECTRIC CO., LTD. (JP) | 2002-11-28 | — | — | US | claimed |
| US-6462148-B1 | RESIN COMPOSITION COMPRISING A POLYMER CONTAINING A QUINOLINE RING AND A THERMOSETTING RESIN, AN INSULATING MATERIAL CONSTITUTED BY SAID RESIN COMPOSITION AND AN ADHESIVE FILM, PARTICULARLY A RESIN FOR AN INTERLAYER INSULATION FILM | HITACHI CHEMICAL CO., LTD. (JP) | 2002-10-08 | — | — | US | claimed |
| US-20020106516-A1 | Resin compound for fabricating interlayer dielectric of printed wiring board, resin sheet and resin applied-copper foil for forming insulating layer using the resin compound, and copper-clad laminate using them | MITSUI MINING & SMELTING CO., LTD. | 2002-08-08 | — | — | US | claimed |
| US-6156870-A | Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-12-05 | — | — | US | claimed |
| US-6132852-A | LAMINATE OF POLYMER CONDUCTOR AND DIELECTRIC | HITACHI, LTD. (JP) | 2000-10-17 | — | — | US | claimed |
| EP-0449292-B1 | Multilayer printed circuit board and production thereof | HITACHI LTD (JP) | 1997-08-20 | — | — | EP | claimed |
| EP-0686170-A4 | DIE-ATTACH COMPOSITIONS | QUANTUM MATERIALS INC (US) | 1997-05-28 | — | — | EP | claimed |
| US-5489641-A | CURABLE MIXTURE CONTAINING LIQUID POLYCYANATE ESTER MONOMER, ELECTROCONDUCTIVE FILLER AND METAL CATALYST | QUANTUM MATERIALS (US) | 1996-02-06 | — | — | US | claimed |
| EP-0686170-A1 | DIE-ATTACH COMPOSITIONS | QUANTUM MATERIALS (US) | 1995-12-13 | — | — | EP | claimed |
| WO-1994019402-A2 | DIE-ATTACH COMPOSITIONS | QUANTUM MATERIALS (US) | 1994-09-01 | — | — | WO | claimed |