SCHEMBL9495339

SCHEMBL9495339

COC1(OC)CC[Si](OC)(c2ccccc2)[Si](OC)(c2ccccc2)O1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5077037 0.74
SCHEMBL28138747 0.72
SCHEMBL6764296 0.71
SCHEMBL9497060 0.71
SCHEMBL7107826 0.70
SCHEMBL1639257 0.60
SCHEMBL28547351 0.60
SCHEMBL5080822 0.60
SCHEMBL7697446 0.59 OPRM1 (0.32)
SCHEMBL29030587 0.58 SLC6A2 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220119578-A1 REACTIVE PRINTABLE COMPOSITION WITH ELASTOMERIC PROPERTIES HENKEL AG & CO KGAA (DE) 2022-04-21 US disclosed
CN-113811435-A Reactive printable composition with elastomeric properties 汉高股份有限及两合公司 2021-12-17 CN disclosed
CN-109312111-B High modulus curable composition 汉高股份有限及两合公司 2021-05-25 CN disclosed
EP-3738745-A1 REACTIVE PRINTABLE COMPOSITION WITH ELASTOMERIC PROPERTIES Henkel AG & Co. KGaA (DE) 2020-11-18 EP disclosed
US-10800881-B2 High modulus curable composition HENKEL AG & CO. KGAA (DE) 2020-10-13 US disclosed
US-20190100618-A1 High Modulus Curable Composition HENKEL AG & CO. KGAA (DE) 2019-04-04 US disclosed
CN-109312111-A high modulus curable composition 汉高股份有限及两合公司 2019-02-05 CN disclosed
US-5198518-A Preparation of polyorganosiloxane resins SHIN-ETSU CHEMICAL COMPANY, LTD. (JP) 1993-03-30 US disclosed