SCHEMBL9503945

SCHEMBL9503945

Cc1c(O)c(C)c(Br)c(Cc2c(Br)c(C)c(O)c(C)c2Br)c1Br

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 6/20 0.55
CA2 P00918 6/20 0.55
CA4 P22748 5/20 0.55
CA6 P23280 5/20 0.55
PTPN1 P18031 2/20 0.55
HIF1A Q16665 3/20 0.39
ALDH1A1 P00352 2/20 0.39
HPGD P15428 2/20 0.39
ALOX15 P16050 2/20 0.39
HSD17B10 Q99714 2/20 0.39
TP53 P04637 2/20 0.39
CYP2C9 P11712 2/20 0.39
CYP2C19 P33261 2/20 0.39
CYP1A2 P05177 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.39
ALOX12 P18054 1/20 0.39
DRD4 P21917 2/20 0.35
MAPK1 P28482 1/20 0.33
RECQL P46063 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9503900 0.83 ALDH1A1 (0.39) CA1CA2CA4CA6PTPN1
SCHEMBL6825433 0.81 DRD4 (0.56) CA1CA2CA4CA6PTPN1
SCHEMBL4602229 0.81 ALDH1A1 (0.38) CA1CA2CA4CA6PTPN1
SCHEMBL10612238 0.81 ALDH1A1 (0.38) CA1CA2CA4CA6PTPN1
SCHEMBL6825519 0.81 ALDH1A1 (0.38) CA1CA2CA4CA6PTPN1
SCHEMBL9813428 0.79 ALDH1A1 (0.37) CA1CA2CA4CA6PTPN1
SCHEMBL10495951 0.79 ALDH1A1 (0.37) CA1CA2CA4CA6PTPN1
SCHEMBL7118812 0.77 HPGD (0.35) CA1CA2CA4CA6PTPN1
SCHEMBL8373097 0.77 DRD4 (0.60) CA1CA2CA4CA6PTPN1
SCHEMBL6825540 0.76 ALDH1A1 (0.46) CA1CA2CA4CA6PTPN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0260571-B1 HALOGENATED EPOXY RESINS AND ADVANCED RESINS PREPARED THEREFROM THE DOW CHEMICAL COMPANY (US) 1993-06-30 EP claimed
US-4895755-A ENCAPSULATION OF ELECTRONIC COMPONENTS THE DOW CHEMICAL COMPANY (US) 1990-01-23 US claimed
WO-1988002012-A1 HALOGENATED EPOXY RESINS AND ADVANCED RESINS PREPARED THEREFROM THE DOW CHEMICAL COMPANY (US) 1988-03-24 WO claimed
EP-0260571-A2 Halogenated epoxy resins and advanced resins prepared therefrom THE DOW CHEMICAL COMPANY (US) 1988-03-23 EP claimed
US-4727119-A HALOGEN ATOM IN META POSITION WITH RESPECT TO GLYCIDYL ETHER ENCAPSULATION ELECTRICAL COMPONENTS THE DOW CHEMICAL COMPANY (US) 1988-02-23 US claimed
EP-0260571-B1 HALOGENATED EPOXY RESINS AND ADVANCED RESINS PREPARED THEREFROM THE DOW CHEMICAL COMPANY (US) 1993-06-30 EP disclosed
EP-0260434-B1 META-HALO-PHENOLIC ALKYLATION PRODUCTS AND EPOXY SYSTEMS THE DOW CHEMICAL COMPANY (US) 1991-08-07 EP disclosed
US-4895755-A ENCAPSULATION OF ELECTRONIC COMPONENTS THE DOW CHEMICAL COMPANY (US) 1990-01-23 US disclosed
WO-1989001466-A1 META-HALO-PHENOLIC ALKYLATION PRODUCTS AND EPOXY SYSTEMS THE DOW CHEMICAL COMPANY (US) 1989-02-23 WO disclosed
WO-1988002012-A1 HALOGENATED EPOXY RESINS AND ADVANCED RESINS PREPARED THEREFROM THE DOW CHEMICAL COMPANY (US) 1988-03-24 WO disclosed
EP-0260571-A2 Halogenated epoxy resins and advanced resins prepared therefrom THE DOW CHEMICAL COMPANY (US) 1988-03-23 EP disclosed
EP-0260434-A1 Meta-halo-phenolic alkylation products and epoxy systems THE DOW CHEMICAL COMPANY (US) 1988-03-23 EP disclosed
US-4731423-A Meta-halo-phenolic alkylation products and epoxy systems THE DOW CHEMICAL COMPANY (US) 1988-03-15 US disclosed
US-4727119-A HALOGEN ATOM IN META POSITION WITH RESPECT TO GLYCIDYL ETHER ENCAPSULATION ELECTRICAL COMPONENTS THE DOW CHEMICAL COMPANY (US) 1988-02-23 US disclosed