⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2088828 | 0.80 | — | — | |
| SCHEMBL2088514 | 0.75 | P2RX7 (0.46) | — | |
| SCHEMBL2163916 | 0.74 | — | — | |
| SCHEMBL11110518 | 0.73 | — | — | |
| SCHEMBL4410876 | 0.73 | MAPK1 (0.43) | — | |
| SCHEMBL15186990 | 0.73 | — | — | |
| SCHEMBL4631233 | 0.72 | — | — | |
| SCHEMBL4405726 | 0.72 | — | — | |
| SCHEMBL8131048 | 0.72 | — | — | |
| SCHEMBL6358213 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 137 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114032548-A | Copper foil etching solution for printed circuit board | 河南慧泽生物工程有限公司 | 2022-02-11 | — | — | CN | claimed |
| CN-113079628-A | Processing method of resistance copper foil material for mobile phone vibration motor PCB | 东莞市科佳电路有限公司 | 2021-07-06 | — | — | CN | claimed |
| CN-104651840-B | Etching composition and the manufacture method for having used its printed circuit board (PCB) | 三菱瓦斯化学株式会社 | 2018-05-01 | — | — | CN | claimed |
| CN-104120427-B | The processing method of wiring substrate and the wiring substrate manufactured using this method | 三菱瓦斯化学株式会社 | 2017-11-28 | — | — | CN | claimed |
| US-9691951-B2 | Curable silicone composition, and optical semiconductor device | DOW CORNING TORAY CO., LTD. (JP) | 2017-06-27 | — | — | US | claimed |
| EP-3059768-A1 | CURABLE SILICONE COMPOSITION, AND OPTICAL SEMICONDUCTOR DEVICE | Dow Corning Toray Co., Ltd. (JP) | 2016-08-24 | — | — | EP | claimed |
| US-20160233395-A1 | Curable Silicone Composition, And Optical Semiconductor Device | DOW TORAY CO., LTD. (JP) | 2016-08-11 | — | — | US | claimed |
| US-9394616-B2 | Etching composition and method for producing printed-wiring board using the same | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2016-07-19 | — | — | US | claimed |
| US-9301399-B2 | Method of treating wiring substrate and wiring substrate manufactured by the same | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2016-03-29 | — | — | US | claimed |
| US-20150144591-A1 | ETCHING COMPOSITION AND METHOD FOR PRODUCING PRINTED-WIRING BOARD USING THE SAME | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-05-28 | — | — | US | claimed |
| CN-104651840-A | Etching composition and method for producing printed-wiring board using the same | MITSUBISHI GAS CHEMICAL CO | 2015-05-27 | — | — | CN | claimed |
| CN-104120427-A | Method of treating wiring substrate and wiring substrate manufactured by same | MITSUBISHI GAS CHEMICAL CO | 2014-10-29 | — | — | CN | claimed |
| US-20140311778-A1 | METHOD OF TREATING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURED BY THE SAME | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2014-10-23 | — | — | US | claimed |
| US-12630931-B2 | Roughening solution for rolled copper foil and method for producing roughened copper foil | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-05-19 | — | — | US | disclosed |
| US-20250011940-A1 | ROUGHENING SOLUTION FOR ROLLED COPPER FOIL AND METHOD FOR PRODUCING ROUGHENED COPPER FOIL | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-01-09 | — | — | US | disclosed |
| CN-118251516-A | Roughening solution for rolled copper foil and method for producing roughened copper foil | 三菱瓦斯化学株式会社 | 2024-06-25 | — | — | CN | disclosed |
| EP-0572178-B1 | Resin compositions for laser marking | GE PLASTICS JAPAN LTD (JP) | 1997-04-16 | — | — | EP | disclosed |
| US-5373039-A | Thermoplastic resin, tetrazole compound and carbon black | GENERAL ELECTRIC COMPANY (US) | 1994-12-13 | — | — | US | disclosed |
| EP-0572178-A1 | Resin compositions for laser marking | GE PLASTICS JAPAN LIMITED (JP) | 1993-12-01 | — | — | EP | disclosed |
| EP-0566312-A1 | Resin compositions for laser marking | GE PLASTICS JAPAN LIMITED (JP) | 1993-10-20 | — | — | EP | disclosed |