SCHEMBL95277

SCHEMBL95277

CCCC(OC)(OC)OOOC(=O)OC(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL95275 0.91 SOAT1 (0.31)
SCHEMBL10528883 0.86
SCHEMBL27995203 0.79
SCHEMBL17939777 0.75 MEN1 (0.33)
SCHEMBL5670340 0.73
SCHEMBL989025 0.71 MEN1 (0.32)
SCHEMBL195258 0.70
SCHEMBL542902 0.70 TSHR (0.35)
SCHEMBL27418546 0.70 LMNA (0.32)
SCHEMBL128838 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0989620-B1 Solid electrolyte and method for producing it DAI ICHI KOGYO SEIYAKU CO LTD (JP) 2004-01-28 EP claimed
US-6329103-B1 THERMAL CROSSLINKING WITH ORGANIC PEROXIDE INITIATOR HAVING SPECIFIC PHYSICAL PROPERTIES THAT DOES NOT CAUSE DEGRADATION OF ELECTROLYTIC SALTS AND VAPORIZATION OF SOLVENTS; ACRYLATED ALKYLENE OXIDE POLYMER DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2001-12-11 US claimed
CN-118202016-A Thermally expandable microcapsule, resin composition for foaming, and foam 积水化学工业株式会社 2024-06-14 CN disclosed
CN-118202007-A Molded body 积水化学工业株式会社 2024-06-14 CN disclosed
WO-2024073539-A1 POLYPROPYLENE PEROXIDE MASTERBATCH FINA TECHNOLOGY, INC. (US) 2024-04-04 WO disclosed
US-20240110048-A1 POLYPROPYLENE PEROXIDE MASTERBATCH FINA TECHNOLOGY, INC. 2024-04-04 US disclosed
CN-116648476-A Thermally expandable microcapsule, expandable master batch, and foam molded article 积水化学工业株式会社 2023-08-25 CN disclosed
CN-114651021-A Curable composition and article 昭和电工材料株式会社 2022-06-21 CN disclosed
US-20150102270-A1 THERMOSETTING CONDUCTIVE SILICONE COMPOSITION, CONDUCTIVE ADHESIVE COMPRISING THE SAME, CONDUCTIVE DIE BONDING MATERIAL COMPRISING THE SAME, AND PHOTOSEMICONDUCTOR APPARATUS HAVING CURED PRODUCT OF DIE BONDING MATERIAL SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-04-16 US disclosed
US-8852842-B2 Production process of toner ZEON CORPORATION (JP) 2014-10-07 US disclosed
US-8696942-B2 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-04-15 US disclosed
US-6720122-B1 TONER IS EXCELLENT IN FIXING ABILITY, SHELF STABILITY AND FLOWABILITY AND PERMITS FORMING IMAGES HAVING HIGH IMAGE QUALITY ZEON CORP. (JP) 2004-04-13 US disclosed
EP-0989620-B1 Solid electrolyte and method for producing it DAI ICHI KOGYO SEIYAKU CO LTD (JP) 2004-01-28 EP disclosed
US-20030130454-A1 Process for producing amphipathic polymers MITSUBISHI RAYON CO., LTD. 2003-07-10 US disclosed
US-6562535-B1 Toner for development of electrostatic image NIPPON ZEON CO., LTD. (JP) 2003-05-13 US disclosed
US-6465368-B2 DISSOLVING POLYMER IN SOLVENT; FORMING DIELECTRIC FILMS JSR CORPORATION (JP) 2002-10-15 US disclosed
EP-1197804-A1 TONER FOR DEVELOPING STATIC CHARGE IMAGE AND METHOD FOR PREPARATION THEREOF NIPPON ZEON CO., LTD. (JP) 2002-04-17 EP disclosed
US-20010051446-A1 Method of manufacturing insulating film-forming material, the insulating film-forming material, and insulating film JSR CORPORATION (JP) 2001-12-13 US disclosed
US-6329103-B1 THERMAL CROSSLINKING WITH ORGANIC PEROXIDE INITIATOR HAVING SPECIFIC PHYSICAL PROPERTIES THAT DOES NOT CAUSE DEGRADATION OF ELECTROLYTIC SALTS AND VAPORIZATION OF SOLVENTS; ACRYLATED ALKYLENE OXIDE POLYMER DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2001-12-11 US disclosed
EP-0989620-A2 Solid electrolyte and method for producing it DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2000-03-29 EP disclosed