SCHEMBL954627

SCHEMBL954627

C=C(C)C(=O)OC1(C2CCCC2)CCCC1

nearest known ligand 0.34

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.34
CYP3A4 P08684 2/20 0.31
ABCB11 O95342 1/20 0.31
LMNA P02545 1/20 0.31
CYP1A2 P05177 1/20 0.31
CHRM2 P08172 1/20 0.31
CHRM4 P08173 1/20 0.31
CHRM5 P08912 1/20 0.31
CYP2D6 P10635 1/20 0.31
CHRM1 P11229 1/20 0.31
CYP2C9 P11712 1/20 0.31
TSHR P16473 1/20 0.31
CHRM3 P20309 1/20 0.31
DRD1 P21728 1/20 0.31
HRH2 P25021 1/20 0.31
HTR2A P28223 1/20 0.31
HTR2C P28335 1/20 0.31
HRH1 P35367 1/20 0.31
DRD3 P35462 1/20 0.31
SCN1A P35498 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9893522 1.00 ALDH1A1 (0.34) ALDH1A1CYP3A4ABCB11LMNACYP1A2
SCHEMBL4824444 0.98 CYP3A4 (0.33) ALDH1A1CYP3A4ABCB11LMNACYP1A2
SCHEMBL4856836 0.98 CYP3A4 (0.33) ALDH1A1CYP3A4ABCB11LMNACYP1A2
SCHEMBL10417245 0.98 CYP3A4 (0.33) ALDH1A1CYP3A4ABCB11LMNACYP1A2
SCHEMBL7920362 0.98 ALDH1A1 (0.33) ALDH1A1CYP3A4ABCB11LMNACYP1A2
SCHEMBL23494272 0.95 ALDH1A1 (0.35) ALDH1A1
SCHEMBL21027180 0.95 ALDH1A1 (0.35) ALDH1A1
SCHEMBL18068623 0.90 ALDH1A1 (0.31) ALDH1A1
SCHEMBL18068624 0.89 CYP3A4 (0.31) CYP3A4ABCB11LMNACYP1A2CHRM2
SCHEMBL18068626 0.89 CYP3A4 (0.31) CYP3A4ABCB11LMNACYP1A2CHRM2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230305398-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-28 US disclosed
CN-115704995-A Curable composition, cured film and application thereof, method for producing cured film, and polymer JSR株式会社 2023-02-17 CN disclosed
CN-114450369-A Adhesive sheet 王子控股株式会社 2022-05-06 CN disclosed
US-20200325361-A1 Temperature-Changeable Adhesive Sheet and Temperature-Changeable Adhesive Sheet Manufacturing Method Using Same LG CHEM, LTD. (KR) 2020-10-15 US disclosed
US-20130289210-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2013-10-31 US disclosed
US-20120328864-A1 OPTICAL DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2012-12-27 US disclosed
EP-2537903-A2 Optical double-sided pressure-sensitive adhesive sheet NITTO DENKO CORPORATION (JP) 2012-12-26 EP disclosed
US-8168366-B2 Low activation energy photoresist composition and process for its use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-05-01 US disclosed
US-8168366-B2 Low activation energy photoresist composition and process for its use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-05-01 US disclosed
US-8168366-B2 Low activation energy photoresist composition and process for its use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-05-01 US disclosed
US-20110008727-A1 Low Activation Energy Photoresist Composition and Process for Its Use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-01-13 US disclosed
US-20110008727-A1 Low Activation Energy Photoresist Composition and Process for Its Use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2011-01-13 US disclosed
US-7476492-B2 Low activation energy photoresist composition and process for its use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-01-13 US disclosed
US-7476492-B2 Low activation energy photoresist composition and process for its use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-01-13 US disclosed
US-7476492-B2 Low activation energy photoresist composition and process for its use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-01-13 US disclosed
US-20070275324-A1 Low activation energy photoresist composition and process for its use GLOBALFOUNDRIES U.S. INC. 2007-11-29 US disclosed
US-20070275324-A1 Low activation energy photoresist composition and process for its use GLOBALFOUNDRIES U.S. INC. 2007-11-29 US disclosed
US-20070275324-A1 Low activation energy photoresist composition and process for its use GLOBALFOUNDRIES U.S. INC. 2007-11-29 US disclosed
US-20070264592-A1 Resist polymer, preparing method, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-11-15 US disclosed
US-20070264592-A1 Resist polymer, preparing method, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-11-15 US disclosed