Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9547092 | 1.00 | MGLL (0.51) | MGLLLPAR1 | |
| SCHEMBL9547039 | 0.98 | MGLL (0.52) | MGLL | |
| SCHEMBL9547035 | 0.98 | MGLL (0.52) | MGLL | |
| SCHEMBL15358731 | 0.94 | LPAR1 (0.49) | MGLLLPAR1 | |
| SCHEMBL11291536 | 0.94 | MGLL (0.50) | MGLLLPAR1 | |
| SCHEMBL29105159 | 0.92 | MGLL (0.48) | MGLLLPAR1 | |
| SCHEMBL258047 | 0.91 | LPAR1 (0.61) | LPAR1 | |
| SCHEMBL29269177 | 0.91 | LPAR1 (0.58) | LPAR1 | |
| SCHEMBL21582226 | 0.91 | LPAR1 (0.61) | LPAR1 | |
| SCHEMBL30864381 | 0.91 | LPAR1 (0.61) | LPAR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-60069156-A | — | — | None | — | — | JP | disclosed |
| EP-3138884-B1 | SOLID DRAWING MATERIAL | MITSUBISHI PENCIL CO (JP) | 2019-08-28 | — | — | EP | disclosed |
| US-10023756-B2 | Solid drawing material | MITSUBISHI PENCIL COMPANY, LIMITED (JP) | 2018-07-17 | — | — | US | disclosed |
| EP-3138884-A1 | SOLID DRAWING MATERIAL | Mitsubishi Pencil Co., Ltd. (JP) | 2017-03-08 | — | — | EP | disclosed |
| US-20170051173-A1 | Solid Drawing Material | MITSUBISHI PENCIL COMPANY, LIMITED (JP) | 2017-02-23 | — | — | US | disclosed |
| EP-0276327-B1 | RESIN COMPOSITION AND PROCESS FOR ITS PREPARATION | TORAY INDUSTRIES, INC. (JP) | 1993-04-07 | — | — | EP | disclosed |
| US-5017650-A | Molding materials | TORAY INDUSTRIES, INC. (JP) | 1991-05-21 | — | — | US | disclosed |
| US-5006610-A | Improved mechanical properties and solvent resistance | TORAY INDUSTRIES, INC. (JP) | 1991-04-09 | — | — | US | disclosed |
| EP-0276327-A1 | RESIN COMPOSITION AND PROCESS FOR ITS PREPARATION | TORAY INDUSTRIES, INC. (JP) | 1988-08-03 | — | — | EP | disclosed |
| JP-S6069156-A | EPOXY RESIN COMPOSITION | OKAMURA SEIYU KK | 1985-04-19 | — | — | JP | disclosed |
| US-4362871-A | REACTED WITH GLYCIDOL TO MAKE NONCHALKING EPOXY RESINS | OKAMURA OIL MILL LIMITED (JP) | 1982-12-07 | — | — | US | disclosed |
| EP-0028024-A1 | Carboxylic acid glycidyl esters, process for their preparation and their use in resin compositions | OKAMURA OIL MILL LIMITED (JP) | 1981-05-06 | — | — | EP | disclosed |