SCHEMBL955902

SCHEMBL955902

C1CCC(C23OC2O3)CC1

nearest known ligand 0.35

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
CHRM2 P08172 1/20 0.31
CHRM4 P08173 1/20 0.31
CHRM5 P08912 1/20 0.31
CHRM1 P11229 1/20 0.31
CHRM3 P20309 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19501748 0.71
SCHEMBL19419124 0.71
SCHEMBL17471395 0.68
SCHEMBL10875380 0.68
SCHEMBL14113062 0.67
SCHEMBL9488890 0.62 CHRM2 (0.31) CHRM2CHRM4CHRM5CHRM1CHRM3
SCHEMBL11801722 0.61
SCHEMBL4654056 0.58 SCN1A (0.31)
SCHEMBL4697737 0.58 SCN1A (0.41)
SCHEMBL5409875 0.58 LMNA (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 68 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115279831-B Composition, cured product, and method for producing cured product 株式会社艾迪科 2024-05-31 CN disclosed
CN-114222773-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2024-04-09 CN disclosed
WO-2024053548-A1 PHOTOCURABLE RESIN SHEET 日東電工株式会社 2024-03-14 WO disclosed
WO-2024029475-A1 WAVELENGTH CONVERSION FILM FORMING COMPOSITION 日産化学株式会社 2024-02-08 WO disclosed
CN-114641515-B Composition, cured product, and method for producing cured product 株式会社艾迪科 2023-12-01 CN disclosed
WO-2023176680-A1 COMPOSITION AND CURED PRODUCT 株式会社ADEKA 2023-09-21 WO disclosed
CN-116745337-A Polymerizable composition, photocurable adhesive, method for producing cured product, and cured product 株式会社艾迪科 2023-09-12 CN disclosed
CN-116249920-A Method for producing colored layer, agent, and laminate 株式会社艾迪科 2023-06-09 CN disclosed
US-20220396677-A1 Cationic Curing Composition for Plastic Substrate, Coating Material, Plastic Product and Application CHANGZHOU GREEN PHOTOSENSITIVE MAT CO LTD (CN) 2022-12-15 US disclosed
CN-115279831-A Composition, cured product, and method for producing cured product 株式会社艾迪科 2022-11-01 CN disclosed
WO-2020022485-A1 CURABLE FILM ADHESIVE AND METHOD OF MANUFACTURING DEVICE リンテック株式会社 2020-01-30 WO disclosed
WO-2019189616-A1 RESIN COMPOSITION, SEALING SHEET, AND SEALING BODY リンテック株式会社 2019-10-03 WO disclosed
WO-2019189618-A1 ELECTRONIC DEVICE-SEALED BODY, SHEET-SHAPED ADHESIVE, ADHESIVE FILM FOR SEALING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE-SEALED BODY リンテック株式会社 2019-10-03 WO disclosed
WO-2019189617-A1 RESIN COMPOSITION, SEALING SHEET, AND SEALED BODY リンテック株式会社 2019-10-03 WO disclosed
CN-109311682-A The method of manufacture thickener and thus manufactured purposes of the thickener in high viscosity non-aqueous formulation 毕克化学有限公司 2019-02-05 CN disclosed
CN-108368408-A Acrylic acid/epoxy mixture material for laminating adhesive application 陶氏环球技术有限责任公司 2018-08-03 CN disclosed
WO-2013032190-A1 PHOTOPOLYMERIZABLE UNSATURATED RESIN, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME, AND LIGHT SHIELDING SPACER AND LIQUID CRYSTAL DISPLAY DEVICE FORMED THEREFROM ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2013-03-07 WO disclosed
CN-102681344-A Photosensitive resin composition, low dielectric constant light shielding layer and liquid crystal display apparatus using the same ROHM & HAAS ELECT MAT 2012-09-19 CN disclosed
US-7875407-B2 epoxy resins; photopolymerization initiators; for liquid crystal displays, plasma displays, electroluminescence panels, video cameras TOPPAN PRINTING CO., LTD. (JP) 2011-01-25 US disclosed
US-20090202750-A1 COLORED ALKALI-DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITION AND COLOR FILTER USING THE SAME TOPPAN PRINTING CO., LTD. (JP) 2009-08-13 US disclosed