SCHEMBL9610285

SCHEMBL9610285

CN1C(=O)c2ccc(C(C)(C(F)(F)F)C(F)(F)F)cc2C1=O

nearest known ligand 0.46

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.46
HSD17B10 Q99714 3/20 0.46
MEN1 O00255 2/20 0.46
MAPT P10636 2/20 0.46
KMT2A Q03164 2/20 0.46
L3MBTL1 Q9Y468 2/20 0.46
HPGD P15428 2/20 0.46
MAPK1 P28482 1/20 0.46
NR1H3 Q13133 3/20 0.44
NR1H2 P55055 2/20 0.44
ALOX15 P16050 1/20 0.44
APP P05067 6/20 0.42
KDM4E B2RXH2 2/20 0.40
CA12 O43570 1/20 0.39
CA1 P00915 1/20 0.39
CA9 Q16790 1/20 0.39
POLB P06746 1/20 0.39
CASP3 P42574 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5535855 0.87 ALDH1A1 (0.50) ALDH1A1HSD17B10MEN1MAPTKMT2A
SCHEMBL14726193 0.86 ALDH1A1 (0.46) ALDH1A1HSD17B10MEN1MAPTKMT2A
SCHEMBL4549126 0.84 ALDH1A1 (0.47) ALDH1A1HSD17B10MEN1MAPTKMT2A
SCHEMBL12570996 0.84 ALDH1A1 (0.47) ALDH1A1HSD17B10MEN1MAPTKMT2A
SCHEMBL15043753 0.82 NR1H3 (0.58) ALDH1A1HSD17B10MEN1MAPTKMT2A
SCHEMBL10053400 0.82 ALDH1A1 (0.52) ALDH1A1HSD17B10MEN1MAPTKMT2A
SCHEMBL28986832 0.81 ALDH1A1 (0.45) ALDH1A1HSD17B10MEN1MAPTKMT2A
SCHEMBL15233557 0.80 ALDH1A1 (0.44) ALDH1A1HSD17B10MEN1MAPTKMT2A
SCHEMBL14567146 0.79 ALDH1A1 (0.46) ALDH1A1HSD17B10MEN1MAPTKMT2A
SCHEMBL27363856 0.79 ALDH1A1 (0.40) ALDH1A1HSD17B10MEN1MAPTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120135251-A1 PHOTOSENSITIVE POLYIMIDE HAVING SILICON MODIFIED GROUP, ADHESIVE COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-05-31 US disclosed