SCHEMBL9614919

SCHEMBL9614919

Nc1ccc(C2CCc3ccccc32)cc1

nearest known ligand 0.54

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
HTR6 P50406 3/20 0.54
SIGMAR1 Q99720 1/20 0.47
CYP11B2 P19099 2/20 0.47
IDO1 P14902 2/20 0.46
ADRA1A P35348 1/20 0.45
DDB1 Q16531 1/20 0.45
CRBN Q96SW2 1/20 0.45
TAAR1 Q96RJ0 1/20 0.44
HAO1 Q9UJM8 1/20 0.43
CYP17A1 P05093 1/20 0.42
CYP19A1 P11511 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29390302 0.84 SIGMAR1 (0.62) SIGMAR1CYP11B2ADRA1ATAAR1
SCHEMBL503849 0.84 SIGMAR1 (0.62) SIGMAR1CYP11B2ADRA1ATAAR1
SCHEMBL30606845 0.82 SIGMAR1 (0.60) SIGMAR1CYP11B2ADRA1ATAAR1
Ammonia Solution, Strong SCHEMBL8210515 0.82 SIGMAR1 (0.60) SIGMAR1CYP11B2ADRA1ATAAR1
SCHEMBL1871239 0.81 SIGMAR1 (0.47) SIGMAR1CYP11B2IDO1ADRA1ATAAR1
SCHEMBL5709417 0.81 PRCP (0.56) SIGMAR1
SCHEMBL21694952 0.81 PRCP (0.56) SIGMAR1CYP11B2ADRA1ATAAR1HAO1
SCHEMBL11767850 0.81 PRCP (0.56) SIGMAR1CYP11B2IDO1ADRA1ATAAR1
SCHEMBL24684598 0.81 DRD1 (0.50) HTR6CYP11B2DDB1CRBNCYP17A1
SCHEMBL28689869 0.81 DDB1 (0.51) HTR6SIGMAR1CYP11B2IDO1ADRA1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022264985-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2022-12-22 WO disclosed
WO-2022264984-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2022-12-22 WO disclosed
WO-2022264987-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2022-12-22 WO disclosed
WO-2022264994-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2022-12-22 WO disclosed
WO-2021117762-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2021-06-17 WO disclosed
CN-108884317-A POLYIMIDE RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND POLYIMIDE FILM 三菱瓦斯化学株式会社 2018-11-23 CN disclosed
EP-0502170-A1 A METHOD FOR OVERWRITING INFORMATION ON OPTICAL DISK MEDIUM. EASTMAN KODAK CO (US) 1992-09-09 EP disclosed
WO-1992005545-A1 A METHOD FOR OVERWRITING INFORMATION ON OPTICAL DISK MEDIUM EASTMAN KODAK COMPANY (US) 1992-04-02 WO disclosed