SCHEMBL9618702

SCHEMBL9618702

CC12CCCC(C)(C1)C(=O)O2

nearest known ligand 0.34

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ACHE P22303 1/20 0.32
F10 P00742 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18377510 0.79
SCHEMBL17893345 0.75 TP53 (0.37) ACHE
SCHEMBL9618765 0.72
SCHEMBL11253651 0.66 ACHE (0.30) ACHE
SCHEMBL9589095 0.64 TP53 (0.39)
SCHEMBL17294071 0.63 KDM4E (0.37) ACHE
SCHEMBL1358214 0.63 KDM4E (0.37) ACHE
SCHEMBL13057404 0.61 F10 (0.36) F10
SCHEMBL15314322 0.61 FFAR3 (0.33) F10
SCHEMBL11241153 0.59

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0153603-B1 THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRODUCTION OF CURED PRODUCT HITACHI, LTD. (JP) 1992-01-02 EP disclosed
US-4607094-A Thermosetting resin composition from aromatic cyanamide HITACHI, LTD. (JP) 1986-08-19 US disclosed
EP-0153603-A2 Thermosetting resin composition, cured product, and production of cured product HITACHI, LTD. (JP) 1985-09-04 EP disclosed