SCHEMBL9632073

SCHEMBL9632073

C=CC(=O)OO.OCC(CO)(CO)COCC(CO)(CO)CO

nearest known ligand 0.57

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.57
TP53 P04637 3/20 0.57
HIF1A Q16665 3/20 0.57
CYP3A4 P08684 2/20 0.57
MAPK1 P28482 1/20 0.57
SMN1; SMN2 Q16637 1/20 0.57
THRB P10828 1/20 0.43
TSHR P16473 6/20 0.38
HSD17B10 Q99714 1/20 0.38
HPGD P15428 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acrylic Acid SCHEMBL1702813 0.94 ALDH1A1 (0.52) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL27922860 0.87 ALDH1A1 (0.59) ALDH1A1TP53HIF1ACYP3A4MAPK1
Pentachlorophenol SCHEMBL1702812 0.86 ALDH1A1 (0.44) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL701226 0.82 ALDH1A1 (0.78) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL20854326 0.82 ALDH1A1 (0.85) ALDH1A1TP53HIF1ACYP3A4MAPK1
Acrylic Acid Methyl Ester SCHEMBL27387417 0.82 ALDH1A1 (0.55) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL18835823 0.82 ALDH1A1 (0.78) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL21550099 0.82 ALDH1A1 (0.78) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL29356945 0.82 ALDH1A1 (0.85) ALDH1A1TP53HIF1ACYP3A4MAPK1
Acrylic Acid SCHEMBL27690259 0.82 ALDH1A1 (0.53) ALDH1A1TP53HIF1ACYP3A4MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0385149-A2 Photocurable adhesive composition and use thereof International Business Machines Corporation (US) 1990-09-05 EP claimed
CN-107078037-A The manufacture method of cutting sheet and semiconductor chip 琳得科株式会社 2017-08-18 CN disclosed
CN-105121482-A Polymer, method for producing same, and resin composition containing same KURARAY CO 2015-12-02 CN disclosed
CN-103554373-A Pallet type resin composition KPICDAWN POLYMER SHANGHAI CO LTD 2014-02-05 CN disclosed
EP-2159262-B1 Optical waveguide comprising a resin film HITACHI CHEMICAL CO LTD (JP) 2013-04-03 EP disclosed
CN-1690853-B Photosensitive resin composition and photosensitive dry film containing the same TOKYO OHKA KOGYO CO LTD 2010-06-16 CN disclosed
CN-1690853-A Photosensitive resin composition and photosensitive dry film containing the same TOKYO OHKA KOGYO CO LTD (JP) 2005-11-02 CN disclosed
CN-1121977-C Thermoplastic resin coated ammonium polyphosphate and process for producing the same BADENHAYM IBERLIKA S A (ES) 2003-09-24 CN disclosed
CN-1229399-A Thermoplastic resin coated ammonium polyphosphate and process for preparation thereof CHISSO CORP (JP) 1999-09-22 CN disclosed
US-5098766-A Glass epoxy prepreg, photocured adhesive, epoxy resins, phenolic resins, acrylated epoxy resins IBM CORPORATION (US) 1992-03-24 US disclosed
US-5098766-A Glass epoxy prepreg, photocured adhesive, epoxy resins, phenolic resins, acrylated epoxy resins IBM CORPORATION (US) 1992-03-24 US disclosed
EP-0385149-A3 PHOTOCURABLE ADHESIVE COMPOSITION AND USE THEREOF International Business Machines Corporation (US) 1991-12-27 EP disclosed
US-5041470-A Flame retardant photocurable adhesive for wires and circuit boards INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1991-08-20 US disclosed
EP-0385149-A2 Photocurable adhesive composition and use thereof International Business Machines Corporation (US) 1990-09-05 EP disclosed
EP-0385149-A2 Photocurable adhesive composition and use thereof International Business Machines Corporation (US) 1990-09-05 EP disclosed