SCHEMBL964092

SCHEMBL964092

CCCO[Si](OCC)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1608777 1.00
SCHEMBL8086469 1.00
SCHEMBL766415 1.00
SCHEMBL23873 0.90 CA1 (0.30)
SCHEMBL1608586 0.89 ADRB2 (0.36)
SCHEMBL1608585 0.89 ADRB2 (0.36)
SCHEMBL22188460 0.89
SCHEMBL1609590 0.89 ADRB2 (0.36)
SCHEMBL26025805 0.87
SCHEMBL28831251 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 207 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114369950-B Special flame retardant for camouflage clothing and preparation method thereof 苏州同构科技有限公司 2024-07-02 CN claimed
EP-3340252-A1 ELECTRODE ASSEMBLY Solvay SA (BE) 2018-06-27 EP claimed
EP-3340253-A1 UV-RESISTANT ELECTRODE ASSEMBLY Solvay SA (BE) 2018-06-27 EP claimed
US-9109121-B2 Sol-gel based antireflective coatings using alkyltrialkoxysilane binders having low refractive index and high durability INTERMOLECULAR, INC. (US) 2015-08-18 US claimed
CN-104152089-A Preparation method of single-segmented epoxy chip packaging sealant XIAMEN THREE NEW MATERIAL TECHNOLOGY CO LTD 2014-11-19 CN claimed
CN-101240154-B Single-component high-peel-strength epoxy resin adhesive and preparation method thereof SHANGHAI HUITIAN CHEMICAL INDUSTRY NEW MATERIAL CO LTD 2012-05-23 CN claimed
CN-101130679-B Adhesion agent and method of manufacturing the same BYD CO LTD 2011-11-16 CN claimed
CN-101240154-A Single-component high peel strength epoxy resin adhesive and preparation method thereof SHANGHAI HUITIAN CHEMICAL INDU (CN) 2008-08-13 CN claimed
CN-101130679-A Adhesion agent and method of manufacturing the same BYD CO LTD (CN) 2008-02-27 CN claimed
CN-1670109-A Modified epoxy resin adhesive and its preparation process LI JIEHUA (CN) 2005-09-21 CN claimed
CN-1015989-B Room temperature curing high-temperature-resistant high-toughness epoxy structural adhesive and preparation method thereof NO 1 BRANCH OF CHENGUANG CHEMI (CN) 1992-03-25 CN claimed
CN-87100265-A Room curing and high temperature resistant high-strong toughness epoxy construction adhesive and preparation method 1988-07-20 CN claimed
US-12473405-B2 Polyorganosiloxane, polyorganosiloxane composition, cured product, polyorganosiloxane-containing electrolytic solution for electrolytic capacitor, and electrolytic capacitor using same MITSUBISHI CHEMICAL CORPORATION (JP) 2025-11-18 US disclosed
WO-2025053280-A1 OPTICAL WAVEGUIDE AND OPTICAL MEMBER HAVING OPTICAL WAVEGUIDE 三菱ケミカル株式会社 2025-03-13 WO disclosed
WO-2025053278-A1 ORGANOPOLYSILOXANE, ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT THEREOF, ORGANOPOLYSILOXANE FOR NEAR-INFRARED OPTICAL WAVEGUIDE, ORGANOPOLYSILOXANE COMPOSITION FOR NEAR-INFRARED OPTICAL WAVEGUIDE, CURED PRODUCT FOR NEAR-INFRARED OPTICAL WAVEGUIDE, NEAR-INFRARED OPTICAL WAVEGUIDE, NEAR-INFRARED OPTICAL TRANSMISSION MEMBER, AND NEAR-INFRARED OPTICAL WAVEGUIDE PRODUCTION METHOD 三菱ケミカル株式会社 2025-03-13 WO disclosed
WO-2025053279-A1 ORGANOPOLYSILOXANE, ORGANOPOLYSILOXANE-CONTAINING RESIN COMPOSITION, CURED PRODUCT THEREOF, ORGANOPOLYSILOXANE FOR NEAR-INFRARED OPTICAL WAVEGUIDE, ORGANOPOLYSILOXANE-CONTAINING RESIN COMPOSITION FOR NEAR-INFRARED OPTICAL WAVEGUIDE, CURED PRODUCT FOR NEAR-INFRARED OPTICAL WAVEGUIDE, NEAR-INFRARED OPTICAL WAVEGUIDE, NEAR-INFRARED OPTICAL TRANSMISSION MEMBER, AND NEAR-INFRARED OPTICAL WAVEGUIDE PRODUCTION METHOD 三菱ケミカル株式会社 2025-03-13 WO disclosed
US-6515073-B2 Comprising di-, tri- and/or tetra-(alkoxy/phenoxy)silanes and a thermosetting resin which can be condensed therewith which has an absorption capacity with respect to exposing light; can be etched at high rate for fine resist patterns TOKYO OHKA KOGYO CO., LTD. (JP) 2003-02-04 US disclosed
US-20010036998-A1 Anti-reflective coating-forming composition TOKYO OHKA KOGYO CO., LTD. (JP) 2001-11-01 US disclosed
CN-1015989-B Room temperature curing high-temperature-resistant high-toughness epoxy structural adhesive and preparation method thereof NO 1 BRANCH OF CHENGUANG CHEMI (CN) 1992-03-25 CN disclosed
CN-87100265-A Room curing and high temperature resistant high-strong toughness epoxy construction adhesive and preparation method 1988-07-20 CN disclosed