Pyridine

Pyridine

SCHEMBL9684738

c1ccc([B-](c2ccccc2)(c2ccccc2)c2ccccc2)cc1.c1ccncc1

nearest known ligand 0.50

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.50
NOTUM Q6P988 1/20 0.50
TSHR P16473 1/20 0.50
NAPRT Q6XQN6 1/20 0.50
SLC6A2 P23975 2/20 0.39
SLC6A4 P31645 2/20 0.39
SLC6A3 Q01959 2/20 0.39
NPC1 O15118 2/20 0.38
RAB9A P51151 2/20 0.38
ATAD2 Q6PL18 1/20 0.38
CYP2A6 P11509 2/20 0.38
ALDH1A1 P00352 2/20 0.38
CYP1A2 P05177 2/20 0.38
CYP3A4 P08684 1/20 0.38
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36
ATM Q13315 1/20 0.35
CYP11B1 P15538 2/20 0.34
CYP11B2 P19099 2/20 0.34
CFTR P13569 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Pyridine SCHEMBL6552258 0.85 TDP1 (0.60) TDP1NOTUMTSHRNAPRTSLC6A2
Hydrochloric Acid SCHEMBL701514 0.82 ALDH1A1 (0.44) TDP1NOTUMTSHRNPC1RAB9A
Hydrochloric Acid SCHEMBL699430 0.82 ALDH1A1 (0.44) TDP1NOTUMTSHRNPC1RAB9A
SCHEMBL11707018 0.82 ALDH1A1 (0.50) TDP1NOTUMTSHRNPC1RAB9A
Benzene SCHEMBL31091106 0.82 ALDH1A1 (0.50) TDP1NOTUMTSHRNPC1RAB9A
SCHEMBL143876 0.82 ALDH1A1 (0.50) TDP1NOTUMTSHRNPC1RAB9A
Pyrazine SCHEMBL8987979 0.80 NOTUM (0.42) NOTUMSLC6A2SLC6A4SLC6A3NPC1
Biphenyl SCHEMBL126611 0.79 NOTUM (0.77) TDP1NOTUMTSHRNAPRTSLC6A2
Biphenyl SCHEMBL29136533 0.79 NOTUM (0.77) TDP1NOTUMTSHRNAPRTSLC6A2
Biphenyl SCHEMBL27563723 0.79 NOTUM (0.77) TDP1NOTUMTSHRNAPRTSLC6A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101142284-B Resin composition, method for producing the resin composition, and molded article of the resin composition IDEMITSU KOSAN CO 2012-09-05 CN disclosed
EP-0503744-A2 Curable resin compositions and semiconductor devices coated and sealed with the same HITACHI, LTD. (JP) 1992-09-16 EP disclosed
EP-0237255-A2 Curable resin compositions and semiconductor devices coated and sealed with the same HITACHI, LTD. (JP) 1987-09-16 EP disclosed
US-4056579-A Novel thermosetting resin composition and cured product therefrom HITACHI, LTD. (JA) 1977-11-01 US disclosed