SCHEMBL968772

SCHEMBL968772

C=CC(=O)OC(CC[Si](OC)(OC)OC)OCC

nearest known ligand 0.32

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.32
SMN1; SMN2 Q16637 1/20 0.31
HPGD P15428 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3044342 0.89 TSHR (0.36) TSHRSMN1; SMN2HPGD
SCHEMBL970915 0.88 TSHR (0.32) TSHRSMN1; SMN2HPGD
SCHEMBL8863714 0.86 TSHR (0.44) TSHRHPGD
SCHEMBL9743587 0.86 TSHR (0.34) TSHRSMN1; SMN2HPGD
SCHEMBL7866741 0.82 TSHR (0.32) TSHRHPGD
SCHEMBL1507509 0.80 TSHR (0.40) TSHRSMN1; SMN2HPGD
SCHEMBL3792945 0.79 ALDH1A1 (0.33) TSHR
SCHEMBL8752637 0.78 TSHR (0.36) TSHRHPGD
SCHEMBL1132438 0.78 TSHR (0.39) TSHRSMN1; SMN2HPGD
SCHEMBL29226613 0.78 TSHR (0.49) TSHRHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4621123-A1 POLYMER FOR TEXTILE PRINTING INK, EMULSION FOR TEXTILE PRINTING INK CONTAINING SAID POLYMER, AND TEXTILE PRINTING INK Nippon Shokubai Co., Ltd. (JP) 2025-09-24 EP disclosed
WO-2025084131-A1 RESIN COMPOSITION FOR BATTERY MEMBER 株式会社日本触媒 2025-04-24 WO disclosed
WO-2025027984-A1 PRETREATMENT LIQUID FOR INKJET TEXTILE PRINTING 株式会社日本触媒 2025-02-06 WO disclosed
WO-2024225225-A1 RESIN COMPOSITION FOR SINTERING BINDER 株式会社日本触媒 2024-10-31 WO disclosed
WO-2024106276-A1 POLYMER FOR TEXTILE PRINTING INK, EMULSION FOR TEXTILE PRINTING INK CONTAINING SAID POLYMER, AND TEXTILE PRINTING INK 株式会社日本触媒 2024-05-23 WO disclosed
US-8530539-B2 Curable resin composition for nanoimprint DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2013-09-10 US disclosed
US-20120141738-A1 CURABLE RESIN COMPOSITION FOR NANOIMPRINT DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2012-06-07 US disclosed
US-20110008577-A1 PROCESS FOR PRODUCTION OF FINE STRUCTURE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2011-01-13 US disclosed
EP-2261007-A1 PROCESS FOR PRODUCTION OF NANOSTRUCTURES Daicel Chemical Industries, Ltd. (JP) 2010-12-15 EP disclosed
EP-2246371-A1 CURABLE RESIN COMPOSITION FOR NANOIMPRINT Daicel Chemical Industries, Ltd. (JP) 2010-11-03 EP disclosed
US-20090252976-A1 COVER MEMBER FOR PUSH BUTTON SWITCH AND PROCESS FOR PRODUCING THE SAME SHIN-ETSU POLYMER CO., LTD. (JP) 2009-10-08 US disclosed