SCHEMBL969032

SCHEMBL969032

C[Ni](C)C1=CC=CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3892049 0.82
SCHEMBL1358699 0.79 CYP3A4 (0.44)
SCHEMBL20507022 0.68
SCHEMBL2511631 0.66
SCHEMBL2513862 0.66
SCHEMBL640896 0.63
SCHEMBL7049945 0.63
SCHEMBL27475228 0.63
Bromide SCHEMBL5406114 0.61
SCHEMBL4871091 0.61

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1778891-A1 DIVIDED SOLID COMPOSITION COMPOSED OF GRAINS PROVIDED WITH CONTINUOUS METAL DEPOSITION, METHOD FOR THE PRODUCTION AND USE THEREOF IN THE FORM OF A CATALYST Institut National Polytechnique de Toulouse (I.N.P.T) (FR) 2007-05-02 EP claimed
WO-2006008384-A1 DIVIDED SOLID COMPOSITION COMPOSED OF GRAINS PROVIDED WITH CONTINUOUS METAL DEPOSITION, METHOD FOR THE PRODUCTION AND USE THEREOF IN THE FORM OF A CATALYST INSTITUT NATIONAL POLYTECHNIQUE DE TOULOUSE (FR) 2006-01-26 WO claimed
US-20260047479-A1 PACKAGE AND METHOD OF FORMING A PACKAGE INFINEON TECHNOLOGIES AG (DE) 2026-02-12 US disclosed
US-20260021473-A1 THIOL-FUNCTIONALIZED ADSORBENTS FOR HEAVY METAL ION REMOVAL UCHICAGO ARGONNE, LLC (US) 2026-01-22 US disclosed
CN-118354622-A Photovoltaic module, photovoltaic system, solar cell and preparation method of solar cell 隆基绿能科技股份有限公司 2024-07-16 CN disclosed
US-10700006-B2 Manufacturing method of nickel wiring TOKYO ELECTRON LIMITED (JP) 2020-06-30 US disclosed
US-20180090446-A1 MANUFACTURING METHOD OF NICKEL WIRING TOKYO ELECTRON LIMITED (JP) 2018-03-29 US disclosed
US-9287290-B1 3D memory having crystalline silicon NAND string channel SANDISK TECHNOLOGIES INC. (US) 2016-03-15 US disclosed
US-8373149-B2 Resistance change element and manufacturing method thereof NEC CORPORATION (JP) 2013-02-12 US disclosed
US-20110006278-A1 VARIABLE RESISTANCE NON-VOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME NEC CORPORATION (JP) 2011-01-13 US disclosed
US-20110001110-A1 RESISTANCE CHANGE ELEMENT AND MANUFACTURING METHOD THEREOF NEC CORPORATION (JP) 2011-01-06 US disclosed
US-20070161213-A1 Semiconductor device and method of manufacturing the same NEC CORPORATION (JP) 2007-07-12 US disclosed
EP-1778891-A1 DIVIDED SOLID COMPOSITION COMPOSED OF GRAINS PROVIDED WITH CONTINUOUS METAL DEPOSITION, METHOD FOR THE PRODUCTION AND USE THEREOF IN THE FORM OF A CATALYST Institut National Polytechnique de Toulouse (I.N.P.T) (FR) 2007-05-02 EP disclosed
WO-2006008384-A1 DIVIDED SOLID COMPOSITION COMPOSED OF GRAINS PROVIDED WITH CONTINUOUS METAL DEPOSITION, METHOD FOR THE PRODUCTION AND USE THEREOF IN THE FORM OF A CATALYST INSTITUT NATIONAL POLYTECHNIQUE DE TOULOUSE (FR) 2006-01-26 WO disclosed
US-6974763-B1 Method of forming semiconductor device by crystallizing amorphous silicon and forming crystallization promoting material in the same chamber SEMICONDUCTOR ENERGY LABORATORY CO., LTD. (JP) 2005-12-13 US disclosed
US-6156627-A Method of promoting crystallization of an amorphous semiconductor film using organic metal CVD SEMICONDUCTOR ENERGY LABORATORY CO., LTD. (JP) 2000-12-05 US disclosed